Microfluidic device and manufacture thereof

• US 6,769,444 B2
• Filed: 06/04/2003
• Issued: 08/03/2004
• Est. Priority Date: 09/28/2001
• Status: Expired due to Term

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Themont, Jean-Pierre, Guzman, Guillaume
• Primary Examiner(s): CHAMBERS, A MICHAEL
• Application Number:
  US10/454,985
• Publication Number:
  US 20030192587A1
• Time in Patent Office: 426 Days
• Field of Search: 137/15.01, 137/13, 137/833, 137/334, 204/451, 204/601
• US Class Current: 137/15.01
• CPC Class Codes: B01L 3/5027 by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip B01L3/5023 takes precedence; micromixers B01F33/30; microreactors for synthesis B01J19/0093; microcapillary devices in general B81B1/00
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: B81B 2201/058 Microfluidics not provided for in B81B2201/051 - B81B2201/054
• CPC Class Codes: B81B 2203/0353 Holes
• CPC Class Codes: B81C 1/00071 Channels
• CPC Class Codes: B81C 1/00119 Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2201/036 Hot embossing
• CPC Class Codes: C03B 19/063 by hot-pressing powders
• CPC Class Codes: C03B 23/20 Uniting glass pieces by fusing without substantial reshaping
• CPC Class Codes: Y10T 137/0391 Affecting flow by the addition of material or energy
• CPC Class Codes: Y10T 137/0402 Cleaning, repairing, or assembling
• CPC Class Codes: Y10T 137/2224 Structure of body of device
• CPC Class Codes: Y10T 137/6416 With heating or cooling of the system

Abstract

The present invention relates to microfluidic devices and to their method of manufacture. The microfluidic devices are original by their specific structure (of sandwich type) and by the materials from which they are made (mainly glasses, glass ceramics, ceramics), and also by their specific method of manufacture, which is based on a vacuum-forming operation. The microfluidic device includes a first assembly including a microstructure and a first substrate, wherein the microstructure is constructed and arranged on the substrate under vacuum. A second assembly includes a second substrate positioned on the microstructure after the first assembly is presintered and adhered thereto by heat treatment to form a one-piece microstructure defining at least one recess between the first and second substrates.

Claims

1. A method of manufacturing a microfluidic device, the method comprising the steps of:

shaping a mixture including a binder and a precursor material on a first substrate;

presintering the mixture and the substrate to remove the binder and form a consolidated first assembly;

assembling the first assembly with a second assembly comprising a second substrate such that the presintered mixture is positioned between the first substrate and the second assembly; and

heating the assembled first assembly and second assembly to a temperature sufficient to form a one-piece microstructure defining at least one recess between the first and second substrates.

2. The method of claim 1 wherein the step of shaping the mixture on the first substrate includes placing a mold on the first substrate.

3. The Method of claim 2 wherein the step of shaping the mixture on the first substrate further includes injecting the mixture into the mold.

4. The Method of claim 3 wherein the step of shaping the mixture on the first substrate further includes establishing a vacuum between the mold and the first substrate before injecting the mixture into the mold.

5. The method of claim 1 wherein the second assembly further comprises a uniform layer of a mixture including a binder and a precursor material applied to the second substrate and wherein the assembling step comprises the step of affixing the uniform layer of the mixture to the presintered mixture.

6. The method of claim 1 wherein the second assembly further comprises a presintered shaped mixture secured to the second substrate and wherein the assembling step comprises the step of positioning the presintered mixture of the first assembly adjacent the presintered mixture of the second assembly.

7. The method of claim 1 further comprising the step of drilling at least one passage to provide communication between the outside and the at least one recess.

8. The method of claim 1 further comprising the step of repeating the shaping, presintering, assembling, and heating steps to form a plurality of one-piece microstructures and joining the plurality of one-piece microstructures such that they have at least one substrate in common.

9. The method of claim 1 further comprising the step of positioning a part selected from the group consisting essentially of electrical conductors, electrodes and light conductors on an intermediate layer positioned between the first substrate and the mixture.

10. The method of claim 1 wherein the binder is an organic binder.

11. A microfluidic device made by the process claimed in claim 1.