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Scalable wafer inspection

  • US 6,770,862 B1
  • Filed: 07/28/2003
  • Issued: 08/03/2004
  • Est. Priority Date: 07/28/2003
  • Status: Active Grant
First Claim
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1. A scalable imaging system adapted to detect defects on a surface of a substrate using time domain integration sensors, the scalable imaging system comprising:

  • an imaging platform having a plurality of sensor module ports adapted to receive sensor modules, a sensor module removably connected to one of the sensor module ports, the sensor module adapted to optically sense swaths on the surface of the substrate, the sensor module including, a time domain integration sensor adapted to optically sense the swath, the time domain integration sensor having a first width, optics adapted to focus light from the swath on the time domain integration sensor, an analog controller disposed adjacent the time domain integration sensor and adapted to receive analog signals from the time domain integration sensor and provide data signals, and a digital controller adapted to receive the data signals from the analog controller, integrate the data signals into an image of the swath, and provide the image as digital signals to the sensor module port, a master controller adapted to receive the digital signals from the sensor module ports, composite the digital signals into a single image of a desired portion of the surface of the substrate, and to detect defects within the image of the desired portion of the surface of the substrate, and a stage adapted to move the substrate under the sensor modules under the control of the master controller, until the desired portion of the surface of the substrate has been imaged.

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