Scalable wafer inspection
First Claim
Patent Images
1. A scalable imaging system adapted to detect defects on a surface of a substrate using time domain integration sensors, the scalable imaging system comprising:
- an imaging platform having a plurality of sensor module ports adapted to receive sensor modules, a sensor module removably connected to one of the sensor module ports, the sensor module adapted to optically sense swaths on the surface of the substrate, the sensor module including, a time domain integration sensor adapted to optically sense the swath, the time domain integration sensor having a first width, optics adapted to focus light from the swath on the time domain integration sensor, an analog controller disposed adjacent the time domain integration sensor and adapted to receive analog signals from the time domain integration sensor and provide data signals, and a digital controller adapted to receive the data signals from the analog controller, integrate the data signals into an image of the swath, and provide the image as digital signals to the sensor module port, a master controller adapted to receive the digital signals from the sensor module ports, composite the digital signals into a single image of a desired portion of the surface of the substrate, and to detect defects within the image of the desired portion of the surface of the substrate, and a stage adapted to move the substrate under the sensor modules under the control of the master controller, until the desired portion of the surface of the substrate has been imaged.
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Abstract
An imaging system for detecting defects on a substrate. Sensor module ports are disposed on an imaging platform. Sensor modules are removably connected to the sensor module ports, and are adapted to sense swaths on the surface of the substrate. Each of the sensor modules includes a time domain integration sensor, optics, an analog controller, and a digital controller. The time domain integration sensor optically senses the swath. The optics focus light from the swath on the time domain integration sensor. The analog controller receives signals from the time domain integration sensor and provides data signals. The digital controller receives the data signals, integrates the data signals into an image of the swath, and provides the image as digital signals to the sensor module port. A master controller receives the digital signals, composites them into a single image of a desired portion of the surface of the substrate, and detects defects within the image. A stage moves the substrate under the sensor modules under the control of the master controller, until the desired portion of the surface of the substrate has been imaged.
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Citations
20 Claims
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1. A scalable imaging system adapted to detect defects on a surface of a substrate using time domain integration sensors, the scalable imaging system comprising:
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an imaging platform having a plurality of sensor module ports adapted to receive sensor modules, a sensor module removably connected to one of the sensor module ports, the sensor module adapted to optically sense swaths on the surface of the substrate, the sensor module including, a time domain integration sensor adapted to optically sense the swath, the time domain integration sensor having a first width, optics adapted to focus light from the swath on the time domain integration sensor, an analog controller disposed adjacent the time domain integration sensor and adapted to receive analog signals from the time domain integration sensor and provide data signals, and a digital controller adapted to receive the data signals from the analog controller, integrate the data signals into an image of the swath, and provide the image as digital signals to the sensor module port, a master controller adapted to receive the digital signals from the sensor module ports, composite the digital signals into a single image of a desired portion of the surface of the substrate, and to detect defects within the image of the desired portion of the surface of the substrate, and a stage adapted to move the substrate under the sensor modules under the control of the master controller, until the desired portion of the surface of the substrate has been imaged. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A scalable imaging system adapted to detect defects on a surface of a substrate using time domain integration sensors, the scalable imaging system comprising:
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an imaging platform having a plurality of sensor module ports, the sensor module ports disposed side by side on either side of a travel axis of the substrate through the scalable imaging system, sensor modules removably connected to the sensor module ports, the sensor modules adapted to optically sense swaths on the surface of the substrate, wherein the swaths optically sensed by the sensor modules overlap one with another, each of the sensor modules including, a time domain integration sensor adapted to optically sense the swath, the time domain integration sensor having a first width, optics adapted to focus light from the swath on the time domain integration sensor, an analog controller disposed adjacent the time domain integration sensor and adapted to receive analog signals from the time domain integration sensor and provide data signals, and a digital controller adapted to receive the data signals from the analog controller, integrate the data signals into an image of the swath, and provide the image as digital signals to the sensor module port, a master controller adapted to receive the digital signals from the sensor module ports, composite the digital signals into a single image of a desired portion of the surface of the substrate, and to detect defects within the image of the desired portion of the surface of the substrate, and a stage adapted to move the substrate under the sensor modules under the control of the master controller, until the desired portion of the surface of the substrate has been imaged. - View Dependent Claims (14, 15, 16)
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17. A scalable imaging system adapted to detect defects on a surface of a substrate using time domain integration sensors, the scalable imaging system comprising:
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an imaging platform having a plurality of sensor module ports, the sensor module ports disposed on a left side and a right side of a travel axis of the substrate through the scalable imaging system, and the sensor module ports on the left side are offset such that when all of the sensor module ports on the left side of the travel axis are filled with sensor modules, all of a left side of the surface of the substrate is imaged in a single pass, and the sensor module ports on the right side are offset such that when all of the sensor module ports on the right side of the travel axis are filled with sensor modules, all of a right side of the surface of the substrate is imaged in a single pass, the sensor modules removably connected to the sensor module ports, the sensor modules adapted to optically sense swaths on the surface of the substrate, wherein the swaths optically sensed by the sensor modules overlap one with another, each of the sensor modules including, a time domain integration sensor adapted to optically sense the swath, the time domain integration sensor having a first width, optics adapted to focus light from the swath on the time domain integration sensor, an analog controller disposed adjacent the time domain integration sensor and adapted to receive analog signals from the time domain integration sensor and provide data signals, and a digital controller adapted to receive the data signals from the analog controller, integrate the data signals into an image of the swath, and provide the image as digital signals to the sensor module port, wherein the time domain integration sensor, the optics, and the analog controller are all disposed on a single circuit board and the digital controller is not disposed on the circuit board, a master controller adapted to receive the digital signals from the sensor module ports, composite the digital signals into a single image of a desired portion of the surface of the substrate, and to detect defects within the image of the desired portion of the surface of the substrate, and a stage adapted to move the substrate under the sensor modules under the control of the master controller, until the desired portion of the surface of the substrate has been imaged. - View Dependent Claims (18, 19, 20)
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Specification
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Current AssigneeKla-Tencor Technologies Corporation (KLA Corporation)
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Original AssigneeKla-Tencor Technologies Corporation (KLA Corporation)
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InventorsCeglio, Natale M., Maciuca, Dragos
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Primary Examiner(s)PYO, KEVIN K
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Application NumberUS10/628,627Time in Patent Office372 DaysField of Search250/208.1, 250/239, 250/548, 250/559.4, 250/559-1-5, 356/239.7, 356/239.8, 356/237--23, 348/218.1, 348/295US Class Current250/208.1CPC Class CodesG01N 21/9501 Semiconductor wafers manufa...G01N 21/956 Inspecting patterns on the ...
