Cartridge for electronic devices

• US 6,771,509 B2
• Filed: 05/21/2003
• Issued: 08/03/2004
• Est. Priority Date: 05/20/1992
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Wakabayashi, Kenichi, Takayama, Chitoshi, Shiozaki, Tadashi
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US10/442,873
• Publication Number:
  US 20030198023A1
• Time in Patent Office: 440 Days
• Field of Search: 361/684, 361/687, 361/702-711, 361/717-719, 361/732, 361/737, 361/753, 361/761, 361/816, 361/818, 257/718, 257/719, 257/726, 257/727, 365/52, 365/63, 165/80.3, 165/185, 235/380, 235/441, 235/492
• US Class Current: 361/719
• CPC Class Codes: B41J 29/377 Cooling or ventilating arrangements
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07735 the record carrier comprising means for protecting against electrostatic discharge
• CPC Class Codes: G06K 19/07741 comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 5/0256 of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

An add-on cartridge structure for electronic devices having a housing formed from upper and lower case sections. The upper case is typically made from plastic and has a conductive layer formed on inside surfaces, while the lower case is made from a metallic material such as aluminum. A wall-like mating member is disposed on an outer edge of the lower case, and mates with the sides of the upper case to form a nearly rectangular cross section housing. The double conductive layer formed by the outside surface of the mating member and the inside surface of the upper case prevents leakage of electromagnetic radiation from the cartridge. Furthermore, high frequency noise is prevented by grounding both the signal ground of the printed circuit board and the frame ground at multiple locations. The conductive layer has a surface break caused by a through-hole through which the printed circuit board plug protrudes to the outside. Such an opening tends to allow electromagnetic noise to leak outside of the casing, but by grounding the signal and frame grounds at locations near the ends and middle of the plug, harmful noise from electromagnetic radiation is reduced.

Claims

1. An information processing device comprising:

a housing comprising a metal heat conductor and a plurality of passages;

a processor disposed in said housing in thermal communication with said heat conductor, wherein said processor generates heat when energized, and wherein said heat conductor dissipates heat generated by said processor to an area external of said housing through said passages;

a circuit board arranged in said housing and comprising a mounting area, wherein said processor is mounted at said mounting area;

a pusher pushing said processor in a direction toward said heat conductor; and

wherein said pusher is disposed between said processor and said housing.

2. The information processing device of claim 1 wherein said circuit board is a printed circuit board.

3. The information processing device of claim 1 wherein said device is used for printing.

4. An information processing device comprising:

a heat conductive element;

a processor in thermal communication with said heat conductive element, wherein said processor generates heat when energized, and wherein said heat conductive element dissipates heat generated by said processor;

a circuit board comprising a mounting area, wherein said processor is mounted at said mounting area;

a biasing element adapted to bias said processor in a direction toward said heat conductive element; and

wherein the circuit board is disposed between the biasing element and the processor.

5. The information processing device of claim 4 wherein the information processing device is a cartridge.

6. The information processing device of claim 5 wherein the biasing element pushes the circuit board and the processor toward the heat conductive element.

7. The information processing device of claim 5 wherein the heat conductive element is a heat dissipation plate.

8. The information processing device of claim 5 wherein the heat conductive element comprises aluminum.

9. The information processing device of claim 5 wherein the biasing element comprises silicon rubber.

10. The information processing device of claim 4 wherein the information processing device is a cartridge, and wherein an insertion plug including a series of electrical contacts is formed at an end of the circuit board.

11. The information processing device of claim 4 wherein the circuit board is a printed circuit board.

12. The information processing device of claim 4 wherein the information processing device is a cartridge, and wherein a ROM is on the circuit board.

13. The information processing device of claim 4 further comprising an upper case and a lower case on opposite sides of the processor, wherein at least one of the upper case and the lower case comprises aluminum.

14. The information processing device of claim 13 wherein the information processing device is in the form of a cartridge.

15. The information processing device of claim 4 wherein the biasing element comprises an elastic material.

16. The information processing device of claim 4 wherein the processor is in direct contact with the heat conductive element.

17. The information processing device of claim 4 wherein the information processing device further includes a case, and wherein the circuit board is secured to the case.

18. The information processing device of claim 4 wherein the processor is a microprocessor.

19. The information processing device of claim 4 further comprising a plurality of connection pins coupled to the processor.

20. The information processing device of claim 19 wherein the information processing device is in the form of a cartridge.