Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

• US 6,773,332 B2
• Filed: 02/13/2001
• Issued: 08/10/2004
• Est. Priority Date: 08/31/1999
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Moore, Scott E.
• Primary Examiner(s): Rachuba, M.
• Application Number:
  US09/782,914
• Publication Number:
  US 20010006874A1
• Time in Patent Office: 1,274 Days
• Field of Search: 451/5, 451/9, 451/10, 451/41, 451/56, 451/285-290, 451/443, 451/444
• US Class Current: 451/5
• CPC Class Codes: B24B 49/006 taking regard of the speed
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: B24B 53/12 Dressing tools; Holders therefor

Abstract

A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Claims

1. A method for conditioning a planarizing medium used for planarizing a semiconductor substrate, the method comprising:

engaging a conditioning body with the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium;

moving at least one of the conditioning body and the planarizing medium relative to the other of the conditioning body and the planarizing medium to remove material from the planarizing medium; and

maintaining an approximately constant frictional force between the conditioning body and the planarizing medium by selecting a target frictional force, detecting a force between the conditioning body and the planarizing medium by measuring a force transmitted to the support member by the conditioning body, and adjusting a relative velocity between the conditioning body and the planarizing medium until the force is approximately equal to the target frictional force.

2. The method of claim 1 wherein the support member includes a generally upwardly extending portion coupled to the conditioning body and a generally laterally extending portion pivotably coupled to the upwardly extending portion, further wherein detecting the force includes detecting a force between the upwardly extending portion and the laterally extending portion with a force sensor.

3. The method of claim 1 wherein detecting the force includes detecting a deflection of the support member.

4. A method for conditioning a planarizing medium used for planarizing a semiconductor substrate, the method comprising:

engaging a conditioning body with the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, the support member including a generally upwardly extending portion coupled to the conditioning body and a generally laterally extending portion pivotably coupled to the upwardly extending portion;

moving at least one of the conditioning body and the planarizing medium relative to the other of the conditioning body and the planarizing medium to remove material from the planarizing medium; and

maintaining an approximately constant frictional force between the conditioning body and the planarizing medium by selecting a target frictional force, detecting a force between the upwardly extending portion and the laterally extending portion of the support member with a force sensor and adjusting a relative velocity between the conditioning body and the planarizing medium until the force is approximately equal to the target frictional force.

5. The method of claim 4 wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, further wherein detecting the force includes measuring a force transmitted to the support member by the conditioning body.

6. The method of claim 4 wherein detecting the force includes detecting a deflection of the support member.

7. A method for conditioning a planarizing medium used for planarizing a semiconductor substrate, the method comprising:

engaging a conditioning body with the planarizing medium;

moving at least one of the conditioning body and the planarizing medium relative to the other of the conditioning body and the planarizing medium to remove material from the planarizing medium; and

maintaining an approximately constant frictional force between the conditioning body and the planarizing medium by selecting a target frictional force, detecting a force between the conditioning body by detecting a deflection of the support member, and adjusting a relative velocity between the conditioning body and the planarizing medium until the force is approximately equal to the target frictional force.

8. The method of claim 7 wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, further wherein detecting the force includes measuring a force transmitted to the support member by the conditioning body.

9. The method of claim 7 wherein the support member includes a generally upwardly extending portion coupled to the conditioning body and a generally laterally extending portion pivotably coupled to the upwardly extending portion, further wherein detecting the force includes detecting a force between the upwardly extending portion and the laterally extending portion with a force sensor.