Sonic immersion process system and methods

• US 6,774,056 B2
• Filed: 07/19/2002
• Issued: 08/10/2004
• Est. Priority Date: 11/10/1999
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Semitool Incorporated (Applied Materials Incorporated)
• Inventors: Peace, Steven, Kuntz, Jon, Derks, Ed, Aegerter, Brian
• Primary Examiner(s): Smith, Matthew
• Assistant Examiner(s): LEE, GRANVILL D
• Application Number:
  US10/200,043
• Publication Number:
  US 20030056814A1
• Time in Patent Office: 753 Days
• Field of Search: 438/694, 438/758, 438/780-82, 438/906, 438/913, 134/89, 134/134-135, 216/37, 439/55, 439/68, 414/935-936, 414/940
• US Class Current: 438/782
• CPC Class Codes: H01L 21/67057 with the semiconductor substrates being dipped in baths or vessels
• CPC Class Codes: H01L 21/67086 with the semiconductor substrates being dipped in baths or vessels
• CPC Class Codes: H01L 21/6715 Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support
• CPC Class Codes: Y10S 414/135 Associated with semiconductor wafer handling
• CPC Class Codes: Y10S 414/136 including wafer orienting means
• CPC Class Codes: Y10S 414/14 Wafer cassette transporting
• CPC Class Codes: Y10S 438/906 Cleaning of wafer as interim step
• CPC Class Codes: Y10S 438/913 Diverse treatments performed in unitary chamber

Abstract

A process system for processing a semiconductor wafer or other similar flat workpiece has a head including a workpiece holder. A motor in the head spins the workpiece. A head lifter lowers the head to move the workpiece into a bath of liquid in a bowl. Sonic energy is introduced into the liquid and travels through the liquid to the workpiece, to assist in processing. The head is lifted to bring the workpiece to a rinse position. The bath liquid is drained. The workpiece is rinsed via radial spray nozzles in the base. The head is lifted to a dry position. A reciprocating swing arm sprays a drying fluid onto the bottom surface of the spinning wafer, to dry the wafer.

Claims

1. A process system, comprising:

a head having a workpiece holder;

a motor in the head for spinning a workpiece held by the workpiece holder;

a base having a process bowl;

a head lifter attached to the head for moving the head vertically relative to the process bowl between a plurality of processing positions;

a sonic energy source associated with the base;

a swing arm on one of the head and the base; and

a process chemical applicator on the swing arm.

2. The system of claim 1 wherein the applicator comprises at least one spray nozzle.

3. The system of claim 1 further comprising liquid inlets in the base for filling the bowl with liquid.

4. The system of claim 1 further comprising a first weir and a second weir in the bowl.

5. The system of claim 1 further comprising one or more fast drain valves in the base, for draining liquid out of the bowl.

6. The system of claim 1 further comprising at least one radial spray nozzle on the base.

7. The system of claim 1 further comprising a workpiece backside chemical delivery line in the head.

8. A method for processing a workpiece comprising the steps of:

lowering the workpiece to a first position with the workpiece at least partially in a bath of liquid;

introducing sonic energy into the bath of liquid;

lifting the workpiece to a second position above the first position, wherein the workpiece is entirely out of the bath of liquid;

spinning the workpiece;

spraying the workpiece with a rinsing liquid, while the workpiece is at the second position;

lifting the workpiece to a third position above the second position;

swinging an arm under the workpiece; and

applying a drying fluid from the arm onto the workpiece, while the workpiece is spinning.

9. The method of claim 8 wherein the drying fluid comprises IPA.

10. The method of claim 8 wherein the drying fluid comprises a gas.

11. The method of claim 10 wherein the gas comprises heated nitrogen.

12. The method of claim 8 wherein the drying fluid is sprayed onto a down facing surface of the wafer.

13. The method of claim 8 further comprising the step of reciprocating the arm in a back and forth motion, and then moving the arm into a stored position.

14. The method of claim 8 further comprising the step of separately collecting liquid flung off of the workpiece at the second and third positions.

15. The method of claim 8 further comprising the step of draining the bath liquid before applying the drying fluid.

16. The method of claim 8 further comprising the step of sealing the bath of liquid off from the environment, while the workpiece is in the bath of liquid.

17. A process system, comprising:

a head having a workpiece holder;

a motor in the head for spinning a workpiece held by the workpiece holder;

a head lifter attached to the head;

a base having a process bowl;

a resonator plate attached to the process bowl

a sonic energy source attached to the resonator plate;

a swing arm on one of the head and the base; and

a process chemical applicator on the swing arm.

18. A processing system, comprising:

a head having a workpiece holder;

a motor for spinning the workpiece holder;

a head lifter attached to the head;

a base having a process bowl;

a resonator plate attached to the process bowl; and

a sonic energy source attached to the resonator plate.