Microelectronic connections with liquid conductive elements
First Claim
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1. A structure for making a microelectronic assembly comprising:
- a layer of a matrix material having top and bottom surfaces extending in lateral directions;
one or more individual masses of a fusible conductive material dispersed in said layer of matrix material so that said individual conductive masses are spaced apart from one another in said lateral directions and separated from one another by said matrix material, said conductive masses having a melting temperature below about 150°
C.; and
a removable release layer overlying at least one of said surfaces and said one or more individual masses, whereby upon removal of said release layer said at least one of said surfaces is adapted to be adhered to a microelectronic element, wherein said matrix material is selected from the group consisting of (a) compliant materials having degradation temperature higher than the melting temperature of said conductive masses and (b) flowable, curable precursor materials.
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Abstract
A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible masses are surrounded and contained by a compliant material such as an elastomer or gel. The fusible material may melt during operation or processing of the device to relieve thermal cycling stress in the electrical connections.
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Citations
10 Claims
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1. A structure for making a microelectronic assembly comprising:
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a layer of a matrix material having top and bottom surfaces extending in lateral directions;
one or more individual masses of a fusible conductive material dispersed in said layer of matrix material so that said individual conductive masses are spaced apart from one another in said lateral directions and separated from one another by said matrix material, said conductive masses having a melting temperature below about 150°
C.; and
a removable release layer overlying at least one of said surfaces and said one or more individual masses, whereby upon removal of said release layer said at least one of said surfaces is adapted to be adhered to a microelectronic element, wherein said matrix material is selected from the group consisting of (a) compliant materials having degradation temperature higher than the melting temperature of said conductive masses and (b) flowable, curable precursor materials. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification