Reducing oxides on a switching fluid in a fluid-based switch

• US 6,774,325 B1
• Filed: 04/14/2003
• Issued: 08/10/2004
• Est. Priority Date: 04/14/2003
• Status: Expired due to Fees

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Lindsey, John Ralph, Wong, Marvin Glenn
• Primary Examiner(s): Friedhofer, Michael A.
• Application Number:
  US10/414,130
• Time in Patent Office: 484 Days
• Field of Search: 200/182, 200/187-189, 200/209-219, 200/233-236, 310/328, 310/331, 310/348, 310/363, 335/4, 335/47, 335/78, 385/19
• US Class Current: 200/182
• CPC Class Codes: G02B 26/004 based on a displacement or a deformation of a fluid
• CPC Class Codes: H01H 2029/008 using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
• CPC Class Codes: H01H 29/06 Liquid contacts characterised by the material thereof
• CPC Class Codes: H01H 29/28 with level of surface of contact liquid displaced by fluid pressure

Abstract

A fluid-based switch and method for producing the same are disclosed. In one embodiment, the switch is produced by depositing switching fluid on a first substrate; depositing a reducing material so that the reducing material contacts at least a portion of the switching fluid, the reducing material to react with oxides on the switching fluid, and mating a first substrate to a second substrate, the first substrate and the second substrate defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states.

Claims

1. A switch comprising:

first and second mated substrates defining therebetween at least portions of a number of cavities;

a plurality of electrodes exposed within one or more of the cavities;

a switching fluid, held within one or more of the cavities, that serves to open and close at least a pair of the plurality of electrodes in response to forces that are applied to the switching fluid;

a reducing material contacting at least a portion of the switching fluid, the reducing material to react with oxides on the switching fluid; and

an actuating fluid, held within one or more of the cavities, that applies the forces to said switching fluid.

2. The switch of claim 1, wherein the reducing material comprises particles of material mixed with at least a portion of the switching fluid.

3. The switch of claim 1, wherein the reducing material comprises powder mixed with at least a portion of the switching fluid.

4. The switch of claim 1, wherein the reducing material comprises one of carbon, chromium, magnesium, aluminum, titanium, manganese, nickel, and silicon.

5. The switch of claim 1, wherein the switching fluid comprises mercury.

6. The switch of claim 1, wherein the reducing material comprises a solid material deposited on one of the substrates.

7. A switch comprising:

first and second mated substrates defining therebetween at least portions of a number of cavities;

a plurality of wettable pads exposed within one or more of the cavities;

a switching fluid, wettable to said pads and held within one or more of the cavities, that serves to open and block light paths through one or more of the cavities in response to forces that are applied to the switching fluid;

a reducing material contacting at least a portion of the switching fluid, the reducing material to react with oxides on the switching fluid; and

an actuating fluid, held within one or more of the cavities, that applies the forces to said switching fluid.

8. The switch of claim 7, wherein the reducing material comprises particles of material mixed with at least a portion of the switching fluid.

9. The switch of claim 7, wherein the reducing material comprises powder mixed with at least a portion of the switching fluid.

10. The switch of claim 7, wherein the reducing material comprises one of carbon, chromium, magnesium, aluminum, titanium, manganese, nickel, and silicon.

11. The switch of claim 7, wherein the reducing material comprises a solid material deposited on one of the substrates.

12. A method comprising:

depositing a switching fluid on a first substrate;

depositing a solid reducing material so that the reducing material contacts at least a portion of the switching fluid, the reducing material to react with oxides on the switching fluid; and

mating a first substrate to a second substrate, the first substrate and the second substrate defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states.

13. The method of claim 12, wherein the solid reducing material comprises a material having a larger negative reduction potential than the switching fluid.

14. The method of claim 12, wherein the solid reducing material comprises at least one of carbon, chromium, magnesium, aluminum, titanium, manganese, nickel, and silicon.

15. A method comprising:

depositing a switching fluid on a first substrate, the switching fluid mixed with a reducing material, the reducing material to react with oxides on the switching fluid; and

mating a first substrate to a second substrate, the first substrate and the second substrate defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states with respect to the switch contacts.

16. The method of claim 15, wherein the reducing material comprises a material having a larger negative reduction potential than the switching fluid.

17. The method of claim 15, wherein the reducing material comprises at least one of carbon, chromium, magnesium, aluminum, titanium, manganese, nickel, and silicon.

18. The method of claim 15, wherein the reducing material comprises particles of material.

19. The method of claim 15, wherein the reducing material comprises powder.

20. A switch, comprising:

first and second mated substrates defining therebetween at least portions of a number of cavities;

a switching fluid, held within one or more of the cavities, that is movable between at least first and second switch states in response to forces that are applied to the switching fluid;

an actuating fluid, held within one or more of the cavities, that applies the forces to said switching fluid; and

a reducing material mixed with the actuating fluid, the reducing material to react with oxides on the switching fluid during switch state changes.

21. The switch of claim 20, wherein the reducing material comprises liquid.

22. The switch of claim 20, wherein the reducing material comprises lithium aluminum hydride.

23. The switch of claim 20, wherein the reducing material comprises sodium borohydride.

24. The switch of claim 20, wherein the actuating fluid comprises perfluorocarbon oil.

25. The switch of claim 24, wherein the perfluorocarbon oil comprises 3M Fluorinert™

.

26. A method comprising:

depositing a switching fluid in a switching fluid channel;

depositing an actuating fluid mixed with reducing material on a first substrate, the reducing material to contact the switching fluid during switch state changes and to react with oxides on the switching fluid; and

mating the first substrate to a second substrate, the first substrate and the second substrate defining therebetween a first cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states, the first substrate and the second substrate further defining one or more additional cavities holding the actuating fluid mixed with reducing material, the one or more additional cavities connected with the first cavity.

27. The method of claim 26, wherein the reducing material comprises lithium aluminum hydride.

28. The method of claim 26, wherein the reducing material comprises sodium borohydride.

29. The method of claim 26, wherein the actuating fluid comprises 3M Fluorinert™

.