Flat display device

• US 6,774,872 B1
• Filed: 09/27/1999
• Issued: 08/10/2004
• Est. Priority Date: 12/04/1998
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Aoki, Masami, Kawada, Toyoshi
• Primary Examiner(s): Hjerpe, Richard
• Assistant Examiner(s): NGUYEN, KIMNHUNG T
• Application Number:
  US09/405,083
• Time in Patent Office: 1,779 Days
• Field of Search: 345/60, 345/94, 345/68, 345/76, 345/77, 345/204-206, 349/20, 349/32, 349/73, 361/687
• US Class Current: 345/60
• CPC Class Codes: G09G 3/22 using controlled light sources
• CPC Class Codes: G09G 3/298 using surface discharge panels
• CPC Class Codes: G09G 3/30 using electroluminescent panels
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

A flat display device includes a display panel, a driver integrated circuit chip provided adjacent to the display panel in electrical connection thereto, and a heat sink provided adjacent to the display panel, wherein the heat sink carries thereon the driver integrated circuit chip.

Claims

1. A flat display device, comprising:

a display panel comprising a substrate having a peripheral edge;

a driver integrated circuit chip adjacent to the display panel and electrically connected thereto; and

a heat sink, adjacent to the display panel, having an inner peripheral edge disposed adjacent the peripheral edge of the substrate and extending outwardly therefrom, the heat sink carrying thereon the driver integrated circuit chip.

2. A flat display device as claimed in claim 1, wherein the heat sink has a thermal conductivity larger than a thermal conductivity of the display panel.

3. A flat display device as claimed in claim 1, wherein the heat sink further carries thereon a printed circuit board.

4. A flat display device as claimed in claim 1, wherein the heat sink is adhered to the display panel.

5. A flat display device as claimed in claim 1, wherein the heat sink is adhered to an edge of the display panel.

6. A flat display device as claimed in claim 1, wherein the inner peripheral edge of the heat sink comprises a stepped part between first and second portions of the heat sink, the first portion being parallel to and receiving thereon a peripheral bottom surface portion of the substrate of the display panel and the second portion extending outwardly from the peripheral edge of the substrate.

7. A flat display device as claimed in claim 1, wherein the driver integrated circuit chip and the display panel are connected electrically by wire bonding.

8. A flat display device as claimed in claim 1, wherein the driver integrated circuit chip and the display panel are connected electrically by a TAB lead.

9. A flat display device as claimed in claim 1, wherein the display panel is a plasma display panel.

10. A flat display device as claimed in claim 1, wherein the display panel is an electroluminescent display panel.

11. A flat display device as claimed in claim 1, wherein the heat sink includes cooling fins.

12. A flat display device as claimed in claim 1, wherein the heat sink includes a heat pipe.

38. A flat display device as recited in claim 6, wherein:

the heat sink extends along substantially a full length of the peripheral edge of the display panel; and

plural driver integrated circuit chips are carried on the heat sink in spaced relationship along substantially the full length of the peripheral edge the display panel.

40. A flat display device as recited in claim 38, wherein:

the heat sink extends along substantially a full length of the peripheral edge of the display panel; and

plural driver integrated circuit chips are carried on the heat sink in spaced relationship along substantially the full length of the peripheral edge the display panel.

42. A flat display device as recited in claim 38, wherein a groove is provided in a surface of the heat sink on which the driver integrated circuit chip is carried, underlying the driver integrated circuit chip and facilitating access thereto.

44. A flat display device as recited in claim 38, wherein a hole extending through the heat sink is provided in a surface of the heat sink on which the driver integrated circuit chip is carried, underlying the driver integrated circuit chip to facilitate access thereto.

46. A flat display device as recited in claim 38, wherein cooling fins are provided on a surface of the heat sink remote from a rear surface of the display panel.

60. A flat display device as recited in claim 1, wherein respective bottom surfaces of the heat sink and the display panel are substantially in a common plane.

13. A flat display device, comprising:

a display panel;

a driver integrated circuit chip adjacent the display panel and electrically connected thereto; and

a heat sink mounted to the display panel adjacent to a peripheral portion thereof, the heat sink carrying thereon, and being thermally coupled to, the driver integrated circuit chip and the heat sink having an inner peripheral edge extending along an outer periphery of said display panel.

14. A flat display device as claimed in claim 13, wherein the heat sink has a thermal conductivity larger than a thermal conductivity of the display panel.

15. A flat display device as claimed in claim 13, wherein the heat sink further carries thereon a printed circuit board.

16. A flat display device as claimed in claim 13, wherein the heat sink is adhered to the display panel.

17. A flat display device as claimed in claim 13, wherein the heat sink is adhered to the peripheral edge of the display panel.

18. A flat display device as claimed in claim 13, wherein the heat sink includes a stepped part engaging the peripheral edge of the display panel.

19. A flat display device as claimed in claim 13, wherein the driver integrated circuit chip and the display panel are connected electrically by wire bonding.

20. A flat display device as claimed in claim 13, wherein the driver integrated circuit chip and the display panel are connected electrically by a TAB lead.

21. A flat display device as claimed in claim 13, wherein the display panel is a plasma display panel.

22. A flat display device as claimed in claim 13, wherein the display panel is an electroluminescent display panel.

23. A flat display device as claimed in claim 13, wherein the heat sink includes cooling fins.

24. A flat display device as claimed in claim 13, wherein the heat sink includes a heat pipe.

25. A flat display device as recited in claim 13, wherein:

the heat sink extends along substantially a full length of the peripheral edge of the display panel; and

plural driver integrated circuit chips are carried on the heat sink in spaced relationship along substantially the full length of the peripheral edge the display panel.

26. A flat display device as recited in claim 13, wherein

the heat sink further comprises a stepped part having a first portion parallel to and receiving thereon a peripheral bottom surface portion of the display panel and a second portion spaced by a transverse edge from the first portion and disposed adjacent the peripheral edge of the display panel.

27. A flat display device as recited in claim 26, wherein:

the heat sink extends along substantially a full length of the peripheral edge of the display panel; and

plural driver integrated circuit chips are carried on the heat sink in spaced relationship along substantially the full length of the peripheral edge the display panel.

28. A flat display device as recited in claim 13, wherein:

the heat sink is disposed with a first main surface adjacent a peripheral portion of the bottom surface of the rear substrate of the display panel, opposite a viewing surface thereof, and has an outer edge substantially aligned with a corresponding peripheral edge of the display panel; and

the driver integrated circuit chip is mounted on a second main surface, opposite the first main surface, of the heat sink.

29. A flat display device as recited in claim 28, wherein:

the heat sink extends along substantially a full length of the peripheral edge of the display panel; and

plural driver integrated circuit chips are carried on the heat sink in spaced relationship along substantially the full length of the peripheral edge the display panel.

30. A flat display device as recited in claim 26, wherein a groove is provided in a surface of the heat sink on which the driver integrated/circuit chip is carried, underlying the driver integrated circuit chip and facilitating access thereto.

31. A flat display device as recited in claim 28, wherein a groove is provided in a surface of the heat sink on which the driver integrated circuit chip is carried, underlying the driver integrated circuit chip and facilitating access thereto.

32. A flat display device as recited in claim 26, wherein a hole extending through the heat sink is provided in a surface of the heat sink on which the driver integrated circuit chip is carried, underlying the driver integrated circuit chip to facilitate access thereto.

33. A flat display device as recited in claim 28, wherein a hole extending through the heat sink is provided in a surface of the heat sink on which the driver integrated circuit chip is carried, underlying the driver integrated circuit chip to facilitate access thereto.

34. A flat display device as recited in claim 26, wherein cooling fins are provided on a surface of the heat sink remote from a rear surface of the display panel.

35. A flat display device as recited in claim 28, wherein cooling fins are provided on a surface of the heat sink remote from a rear surface of the display panel.

36. A flat display device as recited in claim 13, wherein the heat sink is disposed adjacent to and spaced from a peripheral edge of the display panel, respective bottom surfaces of the heat sink and the display panel being substantially in a common plane.

37. A flat display device as recited in claim 36, wherein:

the heat sink extends along substantially a full length of the peripheral edge of the display panel; and

plural driver integrated circuit chips are carried on the heat sink in spaced relationship along substantially the full length of the peripheral edge the display panel.

39. A flat display device as recited in claim 13, wherein:

the heat sink is disposed with a first main surface adjacent a peripheral portion of a rear surface of the display panel, opposite a viewing surface thereof, and has an outer edge substantially aligned with a corresponding peripheral edge of the display panel; and

the driver integrated circuit chip is mounted on a second main surface opposite the first main surface of the heat sink.

41. A flat display device as recited in claim 37, wherein a groove is provided in a surface of the heat sink on which the driver integrated circuit chip is carried, underlying the driver integrated circuit chip and facilitating access thereto.

43. A flat display device as recited in claim 37, wherein a hole extending through the heat sink is provided in a surface of the heat sink on which the driver integrated circuit chip is carried, underlying the driver integrated circuit chip to facilitate access thereto.

45. A flat display device as recited in claim 37, wherein cooling fins are provided on a surface of the heat sink remote from a rear surface of the display panel.

52. A flat display device as recited in claim 13, wherein:

the heat sink carries the driver integrated circuit chip on a front surface thereof; and

the heat sink is connected at a rear surface thereof to a peripheral bottom surface portion of the rear surface of the display panel, adjacent the peripheral edge thereof.

47. A flat display device, comprising:

a display panel of front and rear substrates respectively having a front, viewing surface and a rear surface and contiguous opposing surfaces, the rear substrate extending beyond the periphery of the front substrate and having a peripheral edge;

a driver integrated circuit chip adjacent to the display panel and electrically connected thereto;

a heat sink mounted on a peripheral bottom surface portion of the rear substrate of the display panel and having a peripheral edge aligned with and extending along the peripheral edge of the rear substrate and of a substantially common length therewith, the heat sink carrying thereon the driver integrated circuit chip; and

wirings extending from the driver integrated circuit chip around the common peripheral edges of the heat sink and the rear substrate electrically connected the driver integrated circuit chip to the display panel.

48. A flat display device as claimed in claim 47, wherein the heat sink has a thermal conductivity larger than a thermal conductivity of the display panel.

49. A flat display device as claimed in claim 47, wherein the heat sink further carries thereon a printed circuit board.

50. A flat display device as claimed in claim 47, wherein the heat sink is adhered to the display panel.

51. A flat display device as claimed in claim 47, wherein the heat sink is adhered to the peripheral rear bottom surface portion of the display panel.

53. A flat display device, comprising:

a display panel having front and rear glass substrates, the rear glass substrate having a peripheral portion;

a heat sink mounted on the peripheral portion of the rear glass substrate; and

a driver integrated circuit chip mounted on and thermally coupled to the heat sink and electrically connected to the display panel.

54. A flat display device as recited in claim 53, wherein the heat sink has a first portion extending under a rear surface of the peripheral portion of the rear glass substrate, an interior edge opposing an outer peripheral edge of the rear glass substrate, and a second portion extending laterally outwardly from the interior edge.

55. A flat display device as recited in claim 54, wherein the heat sink carries the driver integrated circuit chip on the second portion.

56. A flat display device, comprising:

a display panel having front and rear glass substrates, the rear glass substrate having a peripheral portion;

a heat sink mounted on the peripheral portion of the rear glass substrate; and

a driver integrated circuit chip mounted on and thermally coupled to the heat sink and electrically connected to the display panel,

said heat sink having an inner peripheral edge extending along an outer periphery of said rear glass substrate, wherein the heat sink carries the driver integrated circuit chip thereon, and the heat sink is mounted on the peripheral portion of the rear glass substrate such that a bottom surface of the heat sink is attached to a bottom surface of the rear glass substrate.

57. A flat display device, comprising:

a display panel having front and rear glass substrates, the rear glass substrate having a peripheral portion;

a heat sink mounted on the peripheral portion of the rear glass substrate; and

a driver integrated circuit chip mounted on and thermally coupled to the heat sink and electrically connected to the display panel,

said heat sink having an inner peripheral edge extending along an outer periphery of said rear glass substrate, wherein;

a peripheral portion of the rear glass substrate extends beyond a peripheral edge of the front glass substrate and defines an outer peripheral edge of the display panel; and

the heat sink is mounted on the extended peripheral portion of the rear glass substrate.

58. A flat display device as recited in claim 57, wherein the heat sink has an inner edge opposing the outer peripheral edge of the rear glass substrate and extends laterally outwardly therefrom.

59. A flat display device as recited in claim 57, wherein:

the heat sink is disposed on, and adhered to, a rear surface portion of the peripheral portion of the rear glass substrate; and

the driver integrated circuit chip is disposed on and thermally coupled to a surface of the heat sink, remote from the rear substrate.