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Method and apparatus for generating sign-off prototypes for the design and fabrication of integrated circuits

  • US 6,775,808 B1
  • Filed: 08/03/2000
  • Issued: 08/10/2004
  • Est. Priority Date: 08/03/2000
  • Status: Expired due to Term
First Claim
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1. A method for a first party to fabricate a semiconductor device, comprising:

  • receiving a sign-off prototype, the sign-off prototype generated by;

    defining a physical design of a circuit while tracking an error in prediction of a timing value associated with one or more nets in the circuit;

    determining a physical placement level of the circuit when the error in prediction of the timing value satisfies a predetermined threshold; and

    generating the sign-off prototype from the physical placement level of the circuit when the error in prediction of the timing value satisfies a predetermined threshold wherein generating said sign-off prototype is performed without using a physical design tool; and

    after receiving the sign-off prototype, the first party performing;

    generating a second physical design of the circuit from the sign-off prototype;

    generating a GDS file from the second physical design;

    having a mask set generated from the GDS file; and

    having the semiconductor device fabricated using the mask set.

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