Sheet-framed IC carrier, method for producing the same, and IC carrier case
First Claim
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1. A method for producing a sheet-framed IC carrier in which an IC carrier having an IC module is secured with a pressure-sensitive adhesive layer on a backing film in an aperture in a sheet frame, comprising:
- mounting an IC module on a sheet card base;
adhering a backing film having a pressure-sensitive adhesive layer on one surface thereof onto a back surface of said card base; and
cutting and removing a portion corresponding to a peripheral edge of said IC carrier on a top surface of said card base, excluding said backing film, to form a peripheral slit, whereby the sheet frame and the IC carrier secured in the aperture are separated from each other through the peripheral slit.
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Abstract
A sheet-framed IC carrier has a sheet frame having an aperature, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperature of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
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Citations
13 Claims
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1. A method for producing a sheet-framed IC carrier in which an IC carrier having an IC module is secured with a pressure-sensitive adhesive layer on a backing film in an aperture in a sheet frame, comprising:
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mounting an IC module on a sheet card base;
adhering a backing film having a pressure-sensitive adhesive layer on one surface thereof onto a back surface of said card base; and
cutting and removing a portion corresponding to a peripheral edge of said IC carrier on a top surface of said card base, excluding said backing film, to form a peripheral slit, whereby the sheet frame and the IC carrier secured in the aperture are separated from each other through the peripheral slit. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for producing a sheet-framed IC carrier in which an IC carrier having an IC module is secured with a pressure-sensitive adhesive layer on a backing film in an aperture in a sheet frame, comprising:
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forming an aperture in a card base;
adhering a backing film having a pressure-sensitive adhesive layer on one surface thereof, onto a back surface of said card base;
cutting and removing a region between said aperture and a peripheral edge portion of said card base, leaving the backing film, to form a frame slit, whereby the sheet frame may be separated through the frame slit into two or more frame segments; and
securing said IC carrier in said aperture with said adhesive layer on said backing film. - View Dependent Claims (9, 10)
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11. A method for producing a sheet-framed IC carrier in which an IC carrier having an IC module is secured with a pressure-sensitive adhesive layer on a backing film in an aperture in a sheet frame, comprising:
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adhering a backing film having a pressure-sensitive adhesive layer on one surface thereof, onto a back surface of a card base;
forming a mount recess for mounting an IC module therein on a top surface of the card base and cutting and removing a portion corresponding to a peripheral edge of said IC carrier, leaving the backing film, to form a peripheral slit portion; and
mounting an IC module in said mount recess. - View Dependent Claims (12, 13)
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Specification