×

Water-resistant electronic enclosure having a heat sink

  • US 6,778,388 B1
  • Filed: 07/23/2001
  • Issued: 08/17/2004
  • Est. Priority Date: 07/23/2001
  • Status: Active Grant
First Claim
Patent Images

1. A water-resistant electronic device comprising:

  • a housing having an interior portion, said housing is adapted to prevent water from entering said interior portion;

    electronics mounted within said interior portion;

    a fastening member; and

    a heat sink, said heat sink adapted to be coupled to said housing by said fastening member, said heat sink comprising a protuberance that extends into said housing and that is coupled to said fastening member, wherein said heat sink is adapted to transfer heat from said interior portion to the external environment.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×