Microelectronic package with tubular housing

• US 6,778,389 B1
• Filed: 07/03/2003
• Issued: 08/17/2004
• Est. Priority Date: 07/03/2003
• Status: Active Grant

• Current Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Original Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Inventors: Stoica, Vladimir, Glovatsky, Andrew Z.
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US10/613,447
• Time in Patent Office: 411 Days
• Field of Search: 360/676-679, 360/690, 360/704, 360/707, 360/719, 360/721, 165/80.1, 165/185, 174/16.1, 174/16.3
• US Class Current: 361/690
• CPC Class Codes: H01L 25/065 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/148 Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/064 Fluid cooling, e.g. by integral pipes
• CPC Class Codes: H05K 2201/09018 Rigid curved substrate
• CPC Class Codes: H05K 2201/09809 Coaxial layout reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K1/0222
• CPC Class Codes: H05K 7/1434 for electronics exposed to high gravitational force; Cylindrical housings

Abstract

A microelectronic package comprises a tubular housing and a microelectronic assembly affixed to a support that is received in the housing. The support may be a cage-like structure that comprises axial ribs to which the microelectronic assembly is attached. Alternately, the support may comprise a solid surface for affixing a flexible substrate. The microelectronic assembly is arranged with a major surface facing and spaced apart from the inner wall of the housing. Thus, the microelectronic assembly is proximate to the wall to provide an optimum volume for packaging other components. Movement, the spacing between the microelectronic assembly and the tubular housing facilitates coolant gas flow during use to enhance thermal dissipation.

Claims

1. A microelectronic package comprising

a tubular housing comprising an inner wall defining a compartment;

a support received in the compartment;

a microelectronic assembly affixed to the support and including a substrate comprising a major surface, said microelectronic assembly being arranged on said support with said major surface facing the inner wall and spaced apart therefrom by a gas passage and a spacer located between and spacing the support from the housing.

2. A microelectronic package according to claim 1 wherein the spacer is attached to the support and engages the inner wall.

3. A microelectronic package according to claim 1 wherein the support is a cylinder or a polygonal prism and defines a interior chamber suitable for receiving a component.

4. A microelectronic package according to claim 1 wherein the tubular housing comprises a longitudinal axis, and wherein the support comprises a plurality of co-axial ribs to which the substrate is affixed.

5. A microelectronic package according to claim 1 wherein the support comprises a support surface spaced apart from the inner wall, and wherein the substrate is attached to the support surface.

6. A microelectronic package comprising:

a tubular housing comprising a cylindrical inner wall defining a compartment and symmetrical about an axis;

a support received in said compartment and comprising a plurality of axial ribs; and

a microelectronic assembly comprising at least one substrate having a major surface, said microelectronic assembly being affixed to said ribs such that the major surface is parallel to the axis and faces the cylindrical inner wall spaced apart therefrom.

7. A microelectronic package according to claim 6 wherein the microelectronic assembly comprises electronic components attached to the major surface.

8. A microelectronic package according to claim 6 wherein the microelectronic assembly comprises a plurality of substrates and electronic components attached to the substrates, each substrate having axial edges affixed to the ribs, said microelectronic assembly further comprising flexible interconnects extending about said ribs and connecting electronic components on adjacent substrates.

9. A microelectronic package according to claim 6 wherein the support comprises end frames attached to the axial ribs and comprising spacers that extend radially outward from said end frames and engage the cylindrical inner wall to provide spacing between the microelectronic assembly and the cylinder inner wall.

10. A microelectronic package according to claim 6 wherein the support and the microelectronic assembly surround a central chamber suitable for receiving other components.

11. A microelectronic package according to claim 6 wherein the microelectronic assembly is spaced apart from the cylindrical wall to define a peripheral gas passage therebetween for conveying coolant gas.

12. A microelectronic package comprising:

a tubular housing comprising a cylindrical inner wall defining a compartment and symmetrical about an axis;

a support received in the compartment and comprising a support surface spaced apart from the cylindrical inner wall;

a plurality of spacers located between the housing and the support and spacing the support apart from the cylindrical wall, and

a microelectronic assembly formed of a flexible substrate having a major surface and a plurality of microelectronic components attached to the surface, said microelectronic assembly being attached to the support surface such that the major surface faces the cylindrical inner wall and is spaced apart therefrom.

13. A microelectronic package according to claim 12 wherein the plurality of spacers are part of the support, the spacers radially extending above the support surface and engaging the cylindrical inner wall to provide spacing between the microelectronic assembly and the cylinder inner wall.

14. A microelectronic package according to claim 12 wherein the support defines a central chamber.

15. A microelectronic package according to claim 12 wherein the microelectronic assembly is spaced from the cylindrical inner wall to define a peripheral gas passage for conveying coolant gas.