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Method of producing suspended elements for electrical connection between two portions of a micromechanism which can move relative to one another

  • US 6,779,247 B1
  • Filed: 09/29/2000
  • Issued: 08/24/2004
  • Est. Priority Date: 10/01/1999
  • Status: Expired due to Term
First Claim
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1. A method of producing suspended elements between two portions of a micro-mechanism containing components that move relative to one another on a semiconductor wafer, the method comprising:

  • applying the adhesive side of a dry film over the micro-mechanism on the semiconductor wafer to immobilize the moveable components without penetrating any cavities therein;

    forming a mask on the dry film;

    depositing, developing, and selectively removing a sacrificial layer from the mask and the dry film to form windows on the dry film, the dry film protecting the cavities from infiltration of liquids during the developing step;

    opening the windows by selectively etching the dry film;

    depositing a dielectric layer to cover the windows without penetrating any underlying cavities;

    depositing a conductive layer that is attached to at least one moveable portion of the micro-mechanism; and

    selectively removing the conductive layer and the dielectric layer, and removing the dry film to form electrical connection elements suspended between the two portions of the micro-mechanism containing components that move relative to one another.

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