Curing light
First Claim
Patent Images
1. A curing light comprising:
- a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light a light module on said wand, said light module including a secondary heat sink, said secondary heat sink being configured to assist in heat dissipation, and said secondary heat sink having a longitudinal axis, said secondary heat sink having a first, a second and a third mounting platform thereon, each of said first, second and third mounting platforms being generally planar, said first, second and third mounting platforms being arranged with respect to each other at an angle θ
, each of said first, second and third mounting platforms being arranged at an angle φ
with respect to said longitudinal axis of said secondary heat sink, a first light emitting semiconductor chip module mounted on said first mounting platform, a second light emitting semiconductor chip module located on said second mounting platform, and a third light emitting semiconductor chip module located on said third mounting platform, each of said first and said chip modules including a primary heat sink, a light emitting semiconductor chip affixed to said primary heat sink, and a cover covering said chip;
wherein light emitted by said chips converges in an overlapping light beam that creates a light footprint.
1 Assignment
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Accused Products
Abstract
A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
124 Citations
20 Claims
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1. A curing light comprising:
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a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light a light module on said wand, said light module including a secondary heat sink, said secondary heat sink being configured to assist in heat dissipation, and said secondary heat sink having a longitudinal axis, said secondary heat sink having a first, a second and a third mounting platform thereon, each of said first, second and third mounting platforms being generally planar, said first, second and third mounting platforms being arranged with respect to each other at an angle θ
,each of said first, second and third mounting platforms being arranged at an angle φ
with respect to said longitudinal axis of said secondary heat sink,a first light emitting semiconductor chip module mounted on said first mounting platform, a second light emitting semiconductor chip module located on said second mounting platform, and a third light emitting semiconductor chip module located on said third mounting platform, each of said first and said chip modules including a primary heat sink, a light emitting semiconductor chip affixed to said primary heat sink, and a cover covering said chip;
wherein light emitted by said chips converges in an overlapping light beam that creates a light footprint. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A curing light comprising:
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a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light, control buttons located on said wand for use in initiating and terminating light emission by the curing light, an elongate secondary heat sink at least partially located in said wand, said secondary heat sink being configured to assist in heat dissipation, said secondary heat sink having a longitudinal axis, a proximal end and a distal end, said secondary heat sink having a first, a second and a third mounting platform, said mounting platforms being located at said secondary heat sink distal end, a first primary heat sink mounted on said first mounting platform, a first light emitting semiconductor chip mounted to said first primary heat sink, a second primary heat sink mounted on said second mounting platform, a second light emitting semiconductor chip mounted to said second primary heat sink, a third primary heat sink mounted on said third mounting platform, a third light emitting semiconductor chip mounted to said third primary heat sink;
wherein light emitted from said chips overlaps in an overlapping light beam that creates an overlapping light footprint. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification