Method and apparatus for wireless transfer of chemical-mechanical planarization measurements

• US 6,780,082 B2
• Filed: 08/07/2001
• Issued: 08/24/2004
• Est. Priority Date: 08/31/1998
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Moore, Scott E.
• Primary Examiner(s): NGUYEN, GEORGE BINH MINH
• Application Number:
  US09/924,367
• Publication Number:
  US 20010055932A1
• Time in Patent Office: 1,113 Days
• Field of Search: 451/517, 451/41, 451/285-289, 451/53, 451/6, 156/345.13, 438/692-693
• US Class Current: 451/5
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 49/00 Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portion of the planarizing machine. The apparatus further comprises a display spaced apart from the sensor and a wireless communication link coupled between the sensor and the display to transmit a signal from the sensor to the display. The wireless communication link may include an infrared link, a radio link, an acoustic link, or an inductive link. The sensor may measure force, pressure, temperature, pH, electrical resistance or other planarizing parameters. The sensor may also detect light reflected from a reflective surface of a substrate that is used to calibrate the planarizing machine.

Claims

1. An apparatus for transmitting signals from a planarizing device, the planarizing device having a support, a platen assembly connected to the support, and a carrier movable relative to the platen assembly and the support to remove material from a semiconductor substrate positioned between the carrier and the platen assembly, the apparatus comprising:

at least one temperature sensor connected to one of the platen assembly, the carrier, and the semiconductor substrate, the sensor generating a signal corresponding to a value of a selected property of one of the planarizing device and the semiconductor substrate;

an electronic device spaced apart from the sensor; and

a wireless communication link coupled between the sensor and the electronic device to transmit the signal from the sensor to the electronic device, the communication link being comprised of a plurality of optical transmitting transducers coupled to a transmitter attached to the carrier, the communications link being further comprised of a receiving transducer spaced apart from the transmitting transducer, the transmitting transducer moving relative to the receiving transducer while the semiconductor substrate is planarized.

2. The apparatus of claim 1 wherein the electronic device includes a display.

3. The apparatus of claim 1 wherein the electronic device includes a feedback device to change the value of the selected property.

4. The apparatus of claim 1 wherein the temperature sensor includes a thermocouple.

5. The apparatus of claim 1 wherein the sensor is connected to the carrier.

6. The apparatus of claim 1 wherein the sensor is connected to the semiconducter substrate.

7. The apparatus of claim 6 wherein the semiconductor substrate has a conductive material on a surface thereof and the sensor includes an ohm meter coupled to the conductive material to detect a change in resistance of the conductive material when a portion of the conductive material is removed during planarization of the semiconductor substrate.

8. The apparatus of claim 1 wherein the platen assembly is movable relative to the support and the sensor is attached to the platen assembly.

9. The apparatus of claim 1 wherein the display is generally fixed relative to the support.

10. The apparatus of claim 1 further comprising a controller coupled to the planarizing device to change the value of the selected property when the value differs from a selected value.

11. The apparatus of claim 1, further comprising a power supply attached to the carrier and coupled to the sensor to supply power thereto.

12. The apparatus of claim 1 wherein the sensor is a first sensor, the signal is a first signal, and the selected property is a first selected property, further comprising:

a second sensor attached to one of the platen assembly, the carrier, and the semiconductor substrate, the second sensor generating a second signal corresponding to a value of a second selected property; and

a multiplexer coupled to the first and second sensors and the communication link to sequentially transmit the first and second signals to the communication link.

13. The apparatus of claim 1 wherein the communication link includes a plurality of wireless transmitting transducers connected to the sensor and at least one wireless receiver spaced apart from the wireless transmitting transducers, the wireless transmitting transducers moving relative to the wireless receiving transducer when the semiconductor substrate is planarized.

14. The apparatus of claim 1 wherein the signal is an analog signal and the communication link includes a wireless analog transmitting transducer and a wireless analog receiving transducer spaced apart from the wireless analog transmitting transducer.

15. The apparatus of claim 1 wherein the signal is a digital signal communication link includes a wireless digital transmitting transducer and a wireless digital receiving transducer spaced apart from the wireless digital transmitting transducer.

16. The apparatus of claim 1, further comprising a memory device coupled to the sensor to receive the sensor signal and store the sensor signal for a selected period of time.

17. An apparatus for transmitting wireless signals from a planarizing device, the planarizing device having a support, a platen, and a carrier movable relative to the support and the platen to planarize a semiconductor substrate engaged by the carrier as the carrier moves relative to the platen, the apparatus comprising:

at least one temperature sensor coupled to one of the platen, the carrier and the semiconductor substrate to generate a sensor signal corresponding to a value of a selected property of one of the planarizing device and the semiconductor substrate;

a wireless transmitter coupled to a plurality of optical transmitting transducers, the transmitter being operable to receive a signal generated by the at least one temperature sensor and to transmit a wireless transmitter signal from the plurality of optical transmitting transducers; and

a wireless receiver spaced apart from the wireless transmitter to receive the transmitter signal, the wireless receiver being generally fixed relative to the support.

18. The apparatus of claim 17 wherein the wireless transmitter includes a frequency modulating transducer.

19. The apparatus of claim 17 wherein the wireless transmitter includes an amplitude modulating transducer.

20. The apparatus of claim 17 wherein the temperature sensor includes a thermocouple.

21. The apparatus of claim 17 wherein the sensor is a first sensor, the signal is a first signal, and the selected property is a first selected property, further comprising:

a second sensor attached to one of the platen, the carrier, and the semiconductor substrate, the second sensor generating a second signal corresponding to a value of a second selected property; and

a multiplexer coupled to the first and second sensors and the communication link to sequentially transmit the first and second signals to the wireless transmitter.

22. The apparatus of claim 17, further comprising a memory device coupled to the sensor to receive the sensor signal and store the sensor signal for a selected period of time.

23. An apparatus for storing data generated during planarization of semiconductor substrate by a planarizing device, the planarizing device having a support, a platen coupled to the support, and a carrier movable relative to the platen to remove material from a semiconductor substrate positioned between the carrier and the platen, the apparatus comprising:

at least one temperature sensor coupled to the planarizing device to generate a sensor signal corresponding to a value of a selected property of one of the planarizing device and the semiconductor substrate;

a communication link including a wireless transmitter and a wireless receiver spaced apart from the wireless transmitter, the wireless transmitter being coupled to a plurality of transmitting transducers, the transmitter and the transducers moving relative to the wireless receiver while the semiconductor substrate is planarized; and

a memory device coupled to the at least one temperature sensor to receive the temperature sensor signal and store the sensor signal.

24. The apparatus of claim 23, further comprising:

an output device; and

a communication link operatively coupled between the memory device and the output device to transfer the signal from the memory device to the output device.

25. The apparatus of claim 24 wherein the communication link comprises a cable coupled between the memory device and the output device.

26. The apparatus of claim 24 wherein the output device is selected from a display, a chart recorder and a printer.

27. The apparatus of claim 23 wherein the wireless transmitter includes an optical transmitting transducer and the wireless receiver includes an optical receiving transducer.

28. The apparatus of claim 23 wherein the temperature sensor includes a thermocouple.