Microstructures including hydrophilic particles

• US 6,780,491 B1
• Filed: 07/21/2000
• Issued: 08/24/2004
• Est. Priority Date: 12/12/1996
• Status: Expired due to Term

• Current Assignee: Ovonyx Memory Technology, LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Alwan, James J., Tjaden, Kevin, Cathey, David A.
• Primary Examiner(s): Watkins, III, William P.
• Assistant Examiner(s): CHEVALIER, ALICIA ANN
• Application Number:
  US09/621,496
• Time in Patent Office: 1,495 Days
• Field of Search: 428/141, 428/142, 428/143, 428/144, 428/149, 428/156, 428/446, 216/11, 216/12, 216/41, 216/42, 216/49, 216/51
• US Class Current: 428/143
• CPC Class Codes: H01J 9/025 of field emission cathodes
• CPC Class Codes: Y10T 428/24355 Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
• CPC Class Codes: Y10T 428/24372 Particulate matter
• CPC Class Codes: Y10T 428/24421 Silicon containing

Abstract

A substrate is placed on a charging surface, to which a first voltage is applied. Etch-resistant dry particles are placed in a cup in a nozzle to which a second voltage, less than the first voltage, is applied. A carrier gas is directed through the nozzle, which projects the dry particles out of the nozzle toward the substrate. The particles pick up a charge from the potential applied to the nozzle and are electrostatically attracted to the substrate. The particles adhere to the substrate, where they form an etch mask. The substrate is etched and the particles are removed. Emitter tips for a field emission display may be formed in the substrate.

Claims

1. A microstructure comprising:

a substrate; and

a plurality of etch-resistant dry particles, at least some of which particles comprise hydrophilic particles, each particle separated from any other particle disposed on a top surface of the substrate.

2. A microstructure as in claim 1, wherein the substrate includes a layer coating on at least a portion of the top surface of the substrate and the plurality of dry particles is discontinuously disposed on top of the layer.

3. A microstructure as in claim 1, wherein the plurality of dry particles is electrostatically held to the substrate.

4. A microstructure comprising:

a substrate;

a plurality of etch-resistant dry particles discontinuously disposed on a top surface of the substrate; and

wherein the substrate includes a layer coating a least a portion of the top surface of the substrate and the plurality of dry particles is discontinuously disposed on top of the layer and wherein the plurality of dry particles includes a plurality of hydrophilic particles.

5. A microstructure comprising:

a substrate; and

a plurality of etch-resistant dry particles, at least some of which particles comprise hydrophilic particles, disposed on a top surface of the substrate and wherein the particles are distributed having a density of approximately 40,000 particles per square millimeter.

6. A microstructure comprising:

a substrate; and

a monolayer of separated etch-resistant dry particles, at least some of which particles comprise hydrophilic particles, each particle being about 0.5 to about 1.5 microns in diameter.

7. A microstructure comprising:

a substrate; and

a plurality of etch-resistant dry particles, at least some of which particles comprise hydrophilic particles, electrostatically held to a top surface of the substrate.

8. A microstructure comprising:

a substrate of a first material and with defined emitter tips extending from an upper surface of the substrate, and wherein columns made of a material different than that of the substrate are positioned above the emitter tips; and

particles positioned above the columns, at least some of the particles comprising hydrophilic particles.