Temperature measuring method and apparatus, measuring method for the thickness of the formed film, measuring apparatus for the thickness of the formed film thermometer for wafers

• US 6,780,657 B2
• Filed: 07/29/2002
• Issued: 08/24/2004
• Est. Priority Date: 03/19/1998
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Soga, Akira, Akama, Yoshiaki, Ino, Tomomi
• Primary Examiner(s): Kielin, Erik J.
• Assistant Examiner(s): Blum, David S.
• Application Number:
  US10/206,186
• Publication Number:
  US 20020192847A1
• Time in Patent Office: 757 Days
• Field of Search: 438/14, 438/16, 374/130, 216/60, 250/29, 250/559
• US Class Current: 438/14
• CPC Class Codes: G01J 5/0003 for sensing the radiant heat transfer of samples, e.g. emittance meter

Abstract

A temperature measuring apparatus, comprises a light splitting section for splitting the light radiated from a substrate into plural light components having wavelengths over a predetermined wavelength region, a detection section for detecting the intensities of the light components obtained by the light splitting section, an integrated value calculating section for calculating an integrated value of radiation intensity by cumulatively adding the intensities of the light components detected by the detecting section, and a surface temperature calculating section for calculating the surface temperature of the substrate from the integrated value, on the basis of reference data representing the relation between the temperature and the integrated value.

Claims

1. A temperature measuring method, comprising the steps of:

detecting an intensity of light radiated from an object and an intensity of light reflected from said object when the object is illuminated with light;

determining a reflectivity of the object from the intensity of the reflected light and a reference intensity for the reflected light; and

determining the temperature of the object from an emissivity obtained from the reflectivity of the object and the intensity of the light radiated from the object,

wherein a wavelength band at the time of detecting the intensity of the reflected light is the same as that at the time of detecting the intensity of the light radiated from the object.

2. A temperature measuring method, comprising the steps of:

detecting an intensity of light radiated from an object, an intensity of light reflected from the object when the object is illuminated with light, and an intensity of light transmitted through the object when the object is illuminated with light;

determining a reflectivity of the object from the intensity of the reflected light and a reference intensity for the reflected light;

determining a transmittance of the object from the intensity of the transmitted light and a reference intensity for the transmitted light; and

determining the temperature of the object from the reflectivity and from an emissivity obtained from the transmittance of the object and the intensity of the light radiated from the object,

wherein a wavelength band at the time of detecting the intensity of the reflected light is the same as that at the time of detecting the intensity of the light radiated from the object.

3. The method according to claim 2, wherein the temperature is calculated based on the reflectivity, the transmittance, and the intensity of the light radiated from the object, represented by formulas:

4. A temperature measuring method, comprising the steps of:

radiating light form a light source;

transmitting the light radiated from the light source to a surface of an object to be measured and transmitting light reflected and radiated from the object;

turning the light radiated from the light source on and off;

calculating an intensity of the reflected light and an intensity of the radiated light;

calculating a reflectivity of the object to be measured based on the intensity of the reflected light and a reference intensity for reflected light by alternately receiving the light reflected and the light radiated from the object to be measured in synchronism with on and off of the light radiated from the light source; and

calculating a temperature of the object to be measured based on the emissivity obtained from the reflectivity and the intensity of the radiated light obtained in the step of detecting the intensity of the reflected light and the intensity of radiated light,

wherein in said calculating of the intensities of the reflected light and radiated light, a wavelength band at the time of detecting the intensity of the reflected light is the same as that at the time of detecting the intensity of the light radiated from the object.

5. The method according to claim 4, wherein the step of transmitting the light is capable of transmitting only light components having desired wavelengths by using interference filters.

6. The method according to claim 4, wherein step of transmitting the light is capable of splitting only light components having desired wavelengths by using a spectroscope.

7. The method according to claim 4, wherein the light radiated from the light source is spectral light substantially the same as spectral light radiated from the object to be measured.

8. A temperature measuring method, comprising the steps of:

radiating light from a light source;

transmitting the light radiated from the light source to a surface of an object to be measured and transmitting light reflected and radiated from the object to be measured;

turning the light radiated from the light source on and off;

calculating an intensity of the reflected light and an intensity of the radiated light by alternately receiving the light reflected and the light radiated from the object to be measured in synchronism with on and off of the light radiated from the light source;

calculating an intensity of the transmitted light by receiving transmitted light from the object to be measured in synchronism with on and off of the light radiated from the light source;

calculating a reflectivity of the object to be measured based on the intensity of the reflected light and a reference intensity for reflected light;

calculating a transmittance of the object to be measured based on the intensity of the transmitted light and a reference intensity for transmitted light; and

calculating a temperature of the object to be measured based on the emissivity obtained from the reflectivity and the transmittance, and the intensity of radiated light.

9. The method according to claim 8, wherein the step of transmitting the light is capable of transmitting only light components having desired wavelengths by using interference filters.

10. The method according to claim 8, wherein the step of transmitting the light is capable of splitting only light components having desired wavelengths by using a spectroscope.

11. The method according to claim 8, wherein the light radiated from the light source is spectral light substantially the same as spectral light radiated from the object to be measured.

12. A temperature measuring method comprising:

a step of splitting light radiated from a substrate into plural light components having wavelengths ranging over a predetermined wavelength region;

a step of detecting intensity of each of the light components obtained in said light splitting step;

a step of calculating an integrated value of radiation intensity by cumulatively adding the intensities of all of said light components detected in said detecting step; and

a step of calculating a surface temperature of said substrate from said integrated value and preset reference data representing a relation between the temperature and the integrated value.

13. A temperature measuring method comprising:

a laser beam applying step for illuminating a pair of reflecting surfaces of an object with a laser beam;

a light detecting step for detecting interference fringes generated by light reflected from said pair of reflecting surfaces; and

an arithmetic step for calculating a temperature on the basis of a distance between adjacent ones of the interference fringes detected in the light detecting step.

14. The method according to claim 13, wherein a distance between the interference fringes is calculated in the arithmetic step by subjecting a sine wave obtained from an intensity spectrum distribution of an image to a frequency analysis.

15. The method according to claim 14, wherein the maximum entropy method is employed in said arithmetic step to perform frequency analysis on the sine wave.

16. The method according to claim 13, wherein an optical system for correcting changes is employed for remaining positions where the interference fringes are incident unchanged even if positions of said pair of reflecting surfaces are changed.

17. The method according to claim 16, wherein influence on the interference fringes caused by aberration of the optical system for correcting changes is corrected based on the distance said pair of reflecting surfaces move.

18. The method according to claim 13, the method further comprising the steps of:

measuring a distance said interference fringes move; and

calculating a distance said pair of reflecting surfaces move based on the distance said pair of fringes move.

19. The method according to claim 13, wherein an optical system for determining a position is employed in the light detecting step for determining a position at which the laser beam is incident on the object.

20. The method according to claim 19, wherein said optical system for determining the position determines positions in at least two directions on the surface of the object.

21. The method according to claim 13, the method further comprises a step of transmitting only wavelengths of laser beams by using filters before the light detecting step.

22. The method according to claim 13, wherein the laser beam applying step includes a step of adjusting a diameter of the laser beam.