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Process for mounting electronic device and semiconductor device

  • US 6,780,677 B2
  • Filed: 08/21/2002
  • Issued: 08/24/2004
  • Est. Priority Date: 03/27/1997
  • Status: Expired due to Fees
First Claim
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1. A method of fabricating an electronic device having a wiring board mounted a first device and a second device thereon, comprising the steps of:

  • preparing the wiring board having a rigid substrate, a soft layer softer than the rigid substrate formed on the rigid substrate, a plurality of electrode pads formed on the soft layer;

    preparing the first device having a plurality of bumps;

    positioning the first device on the wiring board so as to arrange the bumps on the electrode pads;

    after the step of positioning the first device, mounting the first device to the wiring board by thermocompression bonding using a heater so as to form recesses in the electrode pads by pressure of the bumps, connecting the bumps with the electrode pads in the recesses and filling between the first device and the wiring board with resin;

    preparing the second device having a plurality of external terminals;

    positioning the second device on the wiring board so as to arrange the external terminals on the electrode pads through pasty solder, respectively; and

    after the step of positioning the second device, melting the pasty solder by conducting a heat treatment and fixing the external terminals with the electrode pads by solder.

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