Method for stacking semiconductor die within an implanted medical device
First Claim
1. A method for forming a stackable wafer in an implantable device, comprising:
- forming an opening extending substantially through the wafer;
depositing conductive material within the opening to substantially fill the opening;
forming a bump on and extending outward from an upper surface of the wafer adjacent the conductive material; and
forming a contact pad on and extending outward from a lower surface of the wafer adjacent the conductive material.
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Accused Products
Abstract
A method for forming a stackable wafer for use in an implantable device is provided. The method comprises forming an opening extending substantially through the wafer. Thereafter, conductive material is deposited within the opening to substantially fill the opening. A bump is then formed on an upper surface of the wafer adjacent the conductive material, and a contact pad is formed on a lower surface of the wafer adjacent the conductive material. A second wafer formed using substantially the same process may then be stacked on top of the first wafer with the bump of the first wafer being in contact with the contact pad of the second wafer. A soldering process may then be used to couple the adjacent pad and wafer for physically mounting the wafers and providing electrical connectivity therebetween.
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Citations
25 Claims
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1. A method for forming a stackable wafer in an implantable device, comprising:
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forming an opening extending substantially through the wafer;
depositing conductive material within the opening to substantially fill the opening;
forming a bump on and extending outward from an upper surface of the wafer adjacent the conductive material; and
forming a contact pad on and extending outward from a lower surface of the wafer adjacent the conductive material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for forming a stacked arrangement of a first and second wafer in an implantable device, comprising:
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forming an opening extending substantially through the first wafer;
depositing conductive material within the opening to substantially fill the opening in the first wafer;
forming a bump on an upper surface of the first wafer adjacent the conductive material;
forming a contact pad on a lower surface of the first wafer adjacent the conductive material;
forming an opening extending substantially through the second wafer, depositing conductive material within the opening to substantially fill the opening in the second wafer;
forming a bump on an upper surf ace of the second wafer adjacent the conductive material;
forming a contact pad on a lower surface of the second wafer adjacent the conductive material;
positioning the first water adjacent the second wafer with the bump of the first wafer being adjacent the contact pad of the second wafer; and
coupling the bump of the first wafer with the contact pad of the second wafer. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A method for forming a stackable wafer for use in an implantable medical device, comprising:
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providing a housing;
mounting a semiconductor module inside the housing, wherein said semiconductor module includes first and second semiconductor die in a stacked arrangement, the stacked semiconductor die having circuitry implementing an operational implantable medical device function; and
providing a plurality of electrical connections extending between the die, each electrical connection comprising an interconnection between a bump on an upper surface that extends outward from the upper surface of the first die and a contact pad on a lower surface that extends outward from the lower surface of the second die. - View Dependent Claims (23, 24, 25)
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Specification