Graphical user interface for testing integrated circuits

• US 6,782,331 B2
• Filed: 10/24/2001
• Issued: 08/24/2004
• Est. Priority Date: 10/24/2001
• Status: Expired due to Term

• Current Assignee: Polaris Innovations Limited (Wi-LAN Inc.)
• Original Assignee: Infineon Technologies AG
• Inventors: Ayadi, Kamel
• Primary Examiner(s): Hoff, Marc S.
• Assistant Examiner(s): TSAI, CAROL S W
• Application Number:
  US10/032,876
• Publication Number:
  US 20030078748A1
• Time in Patent Office: 1,035 Days
• Field of Search: 702/68, 702/81, 702/82, 702/83, 702/84, 702/117, 702/118, 702/120-124, 438/14, 438/17, 324/73.1, 324/538, 324/548, 324/754, 324/755, 324/756, 324/759, 324/761, 324/765
• US Class Current: 702/68
• CPC Class Codes: G01R 1/025 concerning dedicated user interfaces, e.g. GUI, or dedicated keyboards G01R31/31912 takes precedence
• CPC Class Codes: G01R 31/2831 Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates G01R31/318511 takes precedence; testing during manufacture H01L22/00
• CPC Class Codes: G01R 31/2834 Automated test systems [ATE]; using microprocessors or computers G01R31/317 takes precedence; ATE for detection of defective computer hardware G06F11/2736

Abstract

A system that includes a graphical user interface (GUI) connected to an input/output device of a computer system and one or more test instruments producing a set of electrical signals. The system also includes a probe card that has a multiple probe needles used for measuring electronic characteristics of each of the devices on a semiconductor wafer. Each device has cells. Each cell has a set of bond pads. The system also has a matrix switch and an interface conduit electrically connecting the one or more test instruments, the computer, the probe card, and the matrix switch together. The semiconductor wafer is moved so that the probe needles measure the electrical characteristics of each cell for each device selected for testing.

Claims

1. A system, comprising:

an input/output device of a computer system, the input/output device providing a graphical user interface (GUI);

one or more test instruments for producing electrical signals;

a probe card having probe needles used for measuring electronic characteristics of devices on a semiconductor wafer, each device having cells, each cell having bond pads, the bond pads being spaced apart by a multiple of a first distance and a multiple of a second distance;

a memory to store a predefined set of value corresponding to a temperature;

a matrix switch; and

an interface conduit electrically connecting the one or more test instruments, the computer system, the probe card, and the matrix switch, the semiconductor wafer being configured to move so that the probe needles measure the electrical characteristics of each cell for each device selected for testing based on a predefined value for the first distance and a predefined value for the second distance, each predefined value corresponding to a testing temperature.

2. The system of claim 1 wherein a user selects a test configuration by interfacing the matrix switch through the GUI.

3. The system of claim 2 wherein the user selects either an automatic test mode or a manual test mode of the semiconductor wafer, the automatic test mode allows the user to select devices for testing.

4. The system of claim 3 wherein the manual test mode includes the user setting the electrical signals of the test instruments through the GUI.

5. The system of claim 4 wherein the probe card transmits electrical signals from each test instrument through the probe needles to the bond pads and generating a test result for each device that is displayed graphically on the display.

6. The system of claim 5 wherein the test instruments include:

a pulse generator; and

a parametric analyzer.

7. The system of claim 1 wherein the testing includes measuring a silicon band gap voltage.

8. The system of claim 1 wherein the testing includes measuring a capacitance.

16. The method of claim 1 wherein the testing includes measuring a silicon band gap voltage.

17. The method of claim 1 wherein the testing includes measuring a capacitance.

9. A method, comprising:

selecting a test configuration through a graphical user interface (GUI) connected to an input/output (I/O) device of a computer;

selecting a temperature for testing; and

measuring electrical characteristics of each device on a semiconductor wafer selected for testing, the probe card having probe needles, each device having cells, each cell having bond pads, each bond pad being separated by a multiple of a first distance and a multiple of a second distance;

selecting a predefined value for the first distance and a predefined value for the second distance from a set of predefined values based on the temperature, each predefined value corresponding to a temperature;

using the predefined value for the first distance and the predefined value for the second distance to move the semiconductor wafer so that the probe needles measure the electrical characteristics of each cell for each device selected for testing.

10. The method of claim 9, further comprising sending a signal to activate test instruments.

11. The method of claim 10, further comprising determining if the test instruments are electrically connected.

12. The method of claim 11, further comprising designating if testing is an automatic test mode or a manual test mode, the automatic test mode includes selecting devices on a semiconductor wafer for testing, the manual test mode includes the user setting the electrical signals of the test instruments through the GUI.

13. The method of claim 12, further comprising generating an output file for all devices tested.

14. The method of claim 13, further comprising graphing data in the output file on a display.

15. The method of claim 14 wherein the test instruments include:

a pulse generator; and

a parametric analyzer.

18. An apparatus for testing devices on a semiconductor wafer using a graphical interface (GUI) comprising:

a memory that stores executable instructions; and

a processor that executes the instructions to;

select a test configuration using the GUI;

select a predefined value for a first distance and a predefined value for a second distance from a set of predefined values based on a temperature selected for testing, each predefined value corresponding to a temperature;

measure electrical characteristics of each device selected for testing, the probe card having probe needles, each device having cells, each cell having bond pads; and

use the predefined value for the first distance and the predefined value for the second distance to move the semiconductor wafer so that the probe needles measure the electrical characteristics of each cell for each device selected for testing.

19. The apparatus of claim 18, further comprising instructions that cause the machine to send a signal to activate test instruments.

20. The apparatus of claim 19, further comprising instructions that cause the machine to determine if the test instruments are electrically connected.

21. The apparatus of claim 20, further comprising instructions that cause the machine to designate if testing is an automatic test mode or a manual test mode, the automatic test includes selecting devices on a semiconductor wafer for testing, the manual test mode includes the user setting the electrical signals of the test instruments through the GUI.

22. The apparatus of claim 21, further comprising instructions that cause the machine to:

generate data in an output file for all devices tested; and

graph data in the output file on a display.

23. The apparatus of claim 18 wherein the testing includes measuring a silicon band gap voltage.

24. The apparatus of claim 18 wherein the testing includes measuring a capacitance.

25. An article comprising a machine-readable medium that stores executable instructions for testing devices on a semiconductor wafer, the instructions causing a machine to:

select a test configuration using a graphical user interface (GUI);

select a predefined value for a first distance and a predefined value for a second distance from a set of predefined values based on a temperature selected for testing, each predefined value corresponding to a temperature;

measure electrical characteristics of each device selected for testing, the probe card having probe needles, each device having cells, each cell having bond pads; and

use the predefined value for the first distance and the predefined value for the second distance to move the semiconductor wafer so that the probe needles measure the electrical characteristics of each cell for each device selected for testing.

26. The article of claim 25, further comprising instructions that cause the machine to send a signal to activate test instruments.

27. The article of claim 26, further comprising instructions that cause the machine to determine if the test instruments are electrically connected.

28. The article of claim 27, further comprising instructions that cause the machine to designate if testing is an automatic test mode or a manual test mode, the automatic test mode includes selecting devices on a semiconductor wafer for testing, the manual test mode includes the user setting the electrical signals of the test instruments through the GUI.

29. The article of claim 28, further comprising instructions that cause the machine to:

generate data in an output file for all devices tested; and

graph data in the output file on a display.

30. The article of claim 29 wherein the test instruments include:

a pulse generator; and

a parametric analyzer.

31. The article of claim 25 wherein the testing includes measuring a silicon band gap voltage.

32. The article of claim 25 wherein the testing includes measuring a capacitance.