Method of making interactive information closure

• US 6,782,601 B2
• Filed: 08/20/2002
• Issued: 08/31/2004
• Est. Priority Date: 09/13/2001
• Status: Expired due to Fees

• Current Assignee: Aloca Closure Systems International
• Original Assignee: Alcoa Closure Systems International Incorporated (Howmet Aerospace, Inc.)
• Inventors: Powell, Mark, Ziegler, John, Carr, Timothy, Smeyak, Larry
• Primary Examiner(s): Trinh, Minh
• Application Number:
  US10/224,177
• Publication Number:
  US 20030061705A1
• Time in Patent Office: 742 Days
• Field of Search: 298/58, 296/01, 296/00, 298/46, 298/47, 298/54, 298/40, 298/32, 298/60, 295/93, 235/492, 235/487, 228/180.21, 428/42.2, 340/572.8, 340/36.9, 343/700.MS, 343/873, 257/673, 257/674, 257/666, 257/735.T, 438/119, 438/455
• US Class Current: 29/601
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49158 with molding of insulated base
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49176 with molding of electrically insulating material

Abstract

A method of making an interactive information package, including an interactive information closure including a radio frequency identification device, contemplates that a microelectronics assembly be provided, and positioned on an associated substrate for positioning adjacent an inside surface of the top wall portion of the closure of the package. In one embodiment, the mounting substrate is provided in the form of a disc-shaped sealing liner for the closure. In an alternate embodiment, the mounting substrate is laminated to an associated sealing liner, with the substrate, and microelectronics assembly positioned thereon, inserted together with the sealing liner into the associated molded closure.

Claims

1. A method of making an interactive information closure, comprising the steps of:

providing a plastic closure having a top wall portion, and an annular depending skirt portion;

providing a microelectronics assembly, including an RFID integrated circuit, an antenna, and one or more interconnections operatively connecting said circuit and said antenna;

providing a mounting substrate, and positioning said microelectronics assembly on said substrate;

providing a punch;

positioning said plastic closure in operative association with said punch; and

inserting said mounting substrate with said microelectronics package thereon into said plastic closure for disposition adjacent to the inside surface of said top wall portion by advancing said punch through a portion of said substrate having said microelectronics assembly thereon to cut said substrate, and insert said microelectronics assembly and an associated portion of substrate into said plastic closure.

2. The method of making an interactive information closure in accordance with claim 1, wherein:

said mounting substrate provides a sealing liner for said plastic closure.

3. The method of making an interactive information closure in accordance with claim 1, including:

printing said antenna and said interconnections on said substrate with electrically-conductive inks.

4. The method of making an interactive information closure in accordance with claim 3, wherein:

said printing step is selected from the group consisting of ink jet printing, silk screen printing, and offset printing.

5. The method of making an interactive information closure in accordance with claim 1, including:

forming said antenna and said interconnections by thin film deposition on said mounting substrate.

6. The method of making an interactive information closure in accordance with claim 5, including:

etching said thin film to form said antenna and interconnections.

7. The method of making an interactive information closure in accordance with claim 1, wherein:

said step of positioning said microelectronics assembly on said mounting substrate including printing said integrated circuit with semi-conductor inks, and said antenna and said interconnections with electrically-conductive inks on said substrate.

8. The method of making an interactive information closure in accordance with claim 1, including:

adhering said microelectronics assembly and said associated portion of said substrate to an inside surface of said top wall portion of said closure.

9. The method of making an interactive information closure in accordance with claim 1, wherein:

said inserting step includes positioning said microelectronics assembly between an inside surface of said top wall portion of said closure and said associated portion of said substrate.