Method of creating a high performance organic semiconductor device
First Claim
1. A method of forming a low resistance contact between a metal material and an organic material of a fabricated organic semiconductor device, the method comprising:
- subjecting the fabricated organic semiconductor device to a temperature higher than 60°
C. and sufficient to cause the metal material to diffuse into the organic material to form a low resistance contact between the metal and the organic material of the organic semiconductor device, substantially without melting the organic material; and
cooling the organic semiconductor device.
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Accused Products
Abstract
A high temperature thermal annealing process creates a low resistance contact between a metal material and an organic material of an organic semiconductor device, which improves the efficiency of carrier injection. The process forms ohmic contacts and Schottky contacts. Additionally, the process may cause metal ions or atoms to migrate or diffuse into the organic material, cause the organic material to crystallize, or both. The resulting organic semiconductor device has enhanced operating characteristics such as faster speeds of operation. Instead of using heat, the process may use other forms of energy, such as voltage, current, electromagnetic radiation energy for localized heating, infrared energy and ultraviolet energy. An example enhanced organic diode comprising aluminum, carbon C60, and copper is described, as well as example insulated gate field effect transistors.
67 Citations
59 Claims
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1. A method of forming a low resistance contact between a metal material and an organic material of a fabricated organic semiconductor device, the method comprising:
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subjecting the fabricated organic semiconductor device to a temperature higher than 60°
C. and sufficient to cause the metal material to diffuse into the organic material to form a low resistance contact between the metal and the organic material of the organic semiconductor device, substantially without melting the organic material; and
cooling the organic semiconductor device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59)
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Specification