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Reticle defect printability verification by resist latent image comparison

  • US 6,784,446 B1
  • Filed: 08/29/2002
  • Issued: 08/31/2004
  • Est. Priority Date: 08/29/2002
  • Status: Active Grant
First Claim
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1. A system for examining a reticle for defect printability comprising:

  • a wafer exposure system for transferring one or more die patterns from a reticle to a resist wafer to form latent images which correspond to the one or more die patterns, wherein the wafer exposure system comprises a latent image inspection system for comparing the latent images to one another in order to verify whether the one or more die patterns are defective.

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