Semiconductor device and manufacturing method thereof
First Claim
Patent Images
1. A semiconductor device comprising:
- a pixel TFT formed in a pixel portion on a substrate;
a p-channel TFT and an n-channel TFT formed in a driving circuit in a periphery of said pixel portion on said substrate;
a color filter formed over at least gate electrodes of the pixel TFT in the pixel portion and the p-channel TFT and the n-channel TFT in the driving circuit;
an interlayer insulating film formed over the color filter, the interlayer insulating film comprising organic insulating material; and
electrodes formed on the interlayer insulating film and electrically connected to the pixel TFT, the p-channel TFT, and the n-channel TFT, respectively, via openings in the color filter and the interlayer insulating film.
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Abstract
There is a problem in that, in a liquid crystal display panel in which a color filter is formed on an opposing substrate, it is necessary to assemble an element substrate and the opposing substrate by extremely high precision position alignment, and when this precision is low, the aperture ratio decreases and the display becomes darker. With the present invention, red color filters (R) are formed on driving circuits (402, 403), peripheral circuits, and a color filter (405d) for protecting a pixel TFT portion (407) is formed for each pixel.
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Citations
46 Claims
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1. A semiconductor device comprising:
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a pixel TFT formed in a pixel portion on a substrate;
a p-channel TFT and an n-channel TFT formed in a driving circuit in a periphery of said pixel portion on said substrate;
a color filter formed over at least gate electrodes of the pixel TFT in the pixel portion and the p-channel TFT and the n-channel TFT in the driving circuit;
an interlayer insulating film formed over the color filter, the interlayer insulating film comprising organic insulating material; and
electrodes formed on the interlayer insulating film and electrically connected to the pixel TFT, the p-channel TFT, and the n-channel TFT, respectively, via openings in the color filter and the interlayer insulating film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
wherein a gate wiring connected to the gate electrodes comprises a low resistance conducting material. -
6. A device according to claim 5, wherein the heat resistant conducting material is an element selected from the group consisting of tantalum (Ta), titanium (Ti), molybdenum (Mo), tungsten (W), a chemical compound comprising at least one element thereof, a nitride comprising at least one element thereof, and a silicide comprising at least one element thereof.
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7. A device according to claim 1, wherein an angle of a tapered portion of each of the gate electrodes is from 5 to 45°
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8. A device according to claim 1, wherein the semiconductor device is a liquid crystal display device.
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9. A device according to claim 1, wherein the semiconductor device is an EL display device.
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10. A device according to claim 1, wherein the semiconductor device is an electronic device selected from the group consisting of a personal computer, a video camera, a portable information terminal, a digital camera, a digital video disk player, and an electronic amusement device.
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11. A semiconductor device comprising:
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a pixel TFT formed in a pixel portion on a substrate;
a p-channel TFT and an n-channel TFT formed in a driving circuit in a periphery of said pixel portion on said substrate;
a protecting insulating film formed over at least gate electrodes of the pixel TFT in the pixel portion and the p-channel TFT and the n-channel TFT in the driving circuit, the protecting insulating film comprising an inorganic insulating material;
a color filter formed over the pixel TFT, the p-channel TFT, and the n-channel TFT with the protective insulating film interposed therebetween;
an interlayer insulating film formed over the color filter, the interlayer insulating film comprising organic insulating material; and
electrodes formed on the interlayer insulating film and electrically connected to the pixel TFT, the p-channel TFT, and the n-channel TFT, respectively, via openings in the protecting insulating film, the color filter, and the interlayer insulating film. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
wherein a gate wiring connected to the gate electrodes comprises a low resistance conducting material. -
18. A device according to claim 17, wherein the heat resistant conducting material is an element selected from the group consisting of tantalum (Ta), titanium (Ti), molybdenum (Mo), tungsten (W), a chemical compound comprising at least one element thereof, a nitride comprising at least one element thereof, and a suicide comprising at least one element thereof.
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19. A device according to claim 11, wherein an angle of a tapered portion of each the gate electrodes is from 5 to 45°
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20. A device according to claim 11, wherein the semiconductor device is a liquid crystal display device.
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21. A device according to claim 11, wherein the semiconductor device is an EL display device.
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22. A device according to claim 11, wherein the semiconductor device is an electronic device selected from the group consisting of a personal computer, a video camera, a portable information terminal, a digital camera, a digital video disk player, and an electronic amusement device.
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23. A semiconductor device comprising:
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a pixel TFT formed in a pixel portion on a substrate; and
a p-channel TFT and an n-channel TFT formed in a driving circuit in a periphery of said pixel portion on said substrate;
a protecting insulating film formed over at least gate electrodes of the pixel TFT, the p-channel TFT and the n-channel TFT in the driving circuit, the protecting insulating film comprising an inorganic insulating material;
a color filter formed over the pixel TFT in the pixel portion and the p-channel TFT and the n-channel TFT in the driving circuit with the protective insulating film interposed therebetween;
an interlayer insulating film formed over the color filter, the interlayer insulating film comprising organic insulating material;
electrodes formed on the interlayer insulating film and electrically connected to the pixel TFT, the p-channel TFT, and the n-channel TFT, respectively, via openings in the protecting film, the color filter, and the interlayer insulating film; and
a pixel electrode formed in the pixel portion and located on the interlayer insulating film, the pixel electrode connected to one of the electrodes which is connected to the pixel TFT. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
wherein a gate wiring connected to the gate electrodes comprises a low resistance conducting material. -
29. A device according to claim 28, wherein the heat resistant conducting material is an element selected from the group consisting of tantalum (Ta), titanium (Ti), molybdenum (Mo), tungsten (W), a chemical compound comprising at least one element thereof, a nitride comprising at least one element thereof, and a silicide comprising at least one element thereof.
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30. A device according to claim 23, wherein an angle of a tapered portion of each the gate electrodes is from 5 to 45°
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31. A device according to claim 23, wherein the semiconductor device is a liquid crystal display device.
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32. A device according to claim 23, wherein the semiconductor device is an EL display device.
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33. A device according to claim 23, wherein the semiconductor device is an electronic device selected from the group consisting of a personal computer, a video camera, a portable information terminal, a digital camera, a digital video disk player, and an electronic amusement device.
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34. A semiconductor device comprising:
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a pixel TFT formed in a pixel portion on a substrate; and
a p-channel TFT and an n-channel TFT formed in a driving circuit in a periphery of said pixel portion on said substrate, a color filter formed over the pixel TFT in the pixel portion and the p-channel TFT and the n-channel TFT in the driving circuit;
an interlayer insulating film formed over the color filter, the interlayer insulating film comprising organic insulating material;
electrodes formed on the interlayer insulating film and electrically connected to the pixel TFT, the p-channel TFT, and the n-channel TFT, respectively, via openings in the color filter and the interlayer insulating film; and
a pixel electrode formed in the pixel portion and located on the interlayer insulating film, the pixel electrode electrically connected to the pixel TFT via one of the electrodes, wherein the pixel TFT is connected to a light emitting element in the pixel portion. - View Dependent Claims (35, 36, 37, 38, 39, 40)
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41. A semiconductor device comprising:
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a pixel TFT formed in a pixel portion on a substrate; and
a p-channel TFT and an n-channel TFT formed in a driving circuit in a periphery of said pixel portion on said substrate, a protecting insulating film formed over at least gate electrodes of the pixel TFT, the p-channel TFT and the n-channel TFT in the driving circuit, the protecting insulating film comprising an inorganic insulating material;
a color filter formed over the pixel TFT in the pixel portion and the p-channel TFT and the n-channel TFT in the driving circuit with the protective insulating film interposed therebetween;
electrodes formed on the interlayer insulating film and electrically connected to the pixel TFT, the p-channel TFT, and the n-channel TFT, respectively, via openings in the protecting film, the color filter, and the interlayer insulating film; and
a pixel electrode formed in the pixel portion and located over the color filter, the pixel electrode connected to one of the electrodes which is connected to the pixel TFT; and
a light emitting element formed in the pixel portion and electrically connected to the pixel TFT. - View Dependent Claims (42, 43, 44, 45, 46)
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Specification