Thin integrated circuit package having an optically transparent window

• US 6,784,534 B1
• Filed: 02/06/2002
• Issued: 08/31/2004
• Est. Priority Date: 02/06/2002
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Di Caprio, Vincent, Webster, Steven, Glenn, Thomas P.
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): CRUZ, LOURDES C
• Application Number:
  US10/067,068
• Time in Patent Office: 937 Days
• Field of Search: 257/704, 257/433, 257/414, 257/749
• US Class Current: 257/704
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

A thin integrated circuit package having an optically transparent window provides a small profile optical integrated circuit assembly for use in digital cameras, video cellular telephones and other devices requiring a small physical size and optical integrated circuit technology. A tape having a conductive metal layer on a surface is used to interface the optical integrated circuit die with electrical interconnects disposed on a surface of the tape opposite the die. A supporting structure surrounds the die and a glass cover is either bonded to the top of the supporting structure over the die, or the glass cover is bonded to the top of the die and the gap between the glass cover and supporting structure filled with encapsulant. The resulting assembly yields a very thin optical integrated circuit package.

Claims

1. An optical integrated circuit, comprising:

a flexible plastic tape having a conductive pattern disposed on a top surface thereof;

a die mounted to the top surface of the tape and electrically coupled to the conductive pattern for providing an electronic function of the integrated circuit;

a support structure surrounding the die and bonded to the top surface of the tape;

a transparent cover mounted over the die such that an optically active surface of the die is accessible through the transparent cover; and

a plurality of external contacts disposed on a bottom surface of the tape opposite the top surface and electrically coupled to the conductive pattern through holes formed in the tape from the bottom surface to the top surface, for providing an electrical interface to the die.

2. The optical integrated circuit of claim 1, wherein the tape is a polyimide tape.

3. The optical integrated circuit of claim 1, wherein the conductive pattern comprises an etched copper pattern on the top surface of the flexible plastic tape.

4. The optical integrated circuit of claim 1, wherein the support structure is a thin metal sheet having an aperture for accepting the die.

5. The optical integrated circuit of claim 1, wherein the support structure is a thin epoxy film.

6. The optical integrated circuit of claim 1, wherein the transparent cover is bonded to the die by an optically transparent adhesive to form an integrated covered die, and further comprising an encapsulant disposed between the support structure and the covered die.

7. The optical integrated circuit of claim 6, wherein a surface of the transparent cover opposite the die is substantially conformal to a top surface of the support structure opposite the tape.

8. The optical integrated circuit of claim 1, wherein the transparent cover is bonded to a top surface of the support structure.

9. The optical integrated circuit of claim 1, wherein the transparent cover is a glass cover.

10. The optical integrated circuit of claim 1, wherein the plurality of electrical contacts are solder balls forming a ball grid array, and wherein the tape is perforated to accept a portion of the solder balls.

11. The optical integrated circuit of claim 10, wherein the conductive pattern is disposed on the top surface of the tape opposite the solder balls and wherein the solder balls contact the conductive pattern through the perforations.

12. The optical integrated circuit of claim 1, further comprising a plurality of wires for electrically coupling the die to the conductive pattern, wherein the wires are bonded to the conductive pattern and the die.

13. The optical integrated circuit of claim 1, further comprising means for mounting the transparent cover over the die.

14. The optical integrated circuit of claim 1, wherein the support structure surrounding the die is a thin metal support structure having an aperture for accepting the die.