High density stackable and flexible substrate-based devices and systems and methods of fabricating
First Claim
1. A computer system comprising:
- an input device;
an output device;
a microprocessor coupled to the input device and the output device; and
a flexible carrier substrate module, coupled to the microprocessor, comprising;
a flexible carrier substrate having a surface portion carrying conductive traces thereon;
at least one semiconductor device connected to the conductive traces; and
a flexible support frame attached to the flexible carrier substrate and having a plurality of conductive paths therethrough connected to the conductive traces to provide electrical coupling of the conductive traces to circuitry external to the flexible carrier substrate.
7 Assignments
0 Petitions
Accused Products
Abstract
A flexible carrier substrate assembly or module that facilitates stacking of multiple carrier substrates bearing semiconductor dice for high density electronic systems. After the dice are placed on the flexible substrate, a flexible support frame may be applied to the flexible substrate. The support frame includes conductive paths therethrough to connect to circuit traces running from the dice on the substrate to the substrate perimeter to interconnect superimposed carrier substrates. The flexible carrier substrates may be bent to a radius of any given curvature to conform to various non-planar regular and irregular surfaces. Furthermore, since the frame as well as the substrate may be flexible, multiple, flexible substrate assemblies may be stacked one on top of another wherein an upper assembly has a different radius than a lower module and any intermediate assemblies have progressively differing radii from bottom to top position.
-
Citations
20 Claims
-
1. A computer system comprising:
-
an input device;
an output device;
a microprocessor coupled to the input device and the output device; and
a flexible carrier substrate module, coupled to the microprocessor, comprising;
a flexible carrier substrate having a surface portion carrying conductive traces thereon;
at least one semiconductor device connected to the conductive traces; and
a flexible support frame attached to the flexible carrier substrate and having a plurality of conductive paths therethrough connected to the conductive traces to provide electrical coupling of the conductive traces to circuitry external to the flexible carrier substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 19, 20)
-
-
8. A computer system comprising:
-
an input device;
an output device;
a microprocessor coupled to the input device and the output device;
a rigid substrate having a first set of conductive traces formed on a surface thereof; and
a flexible carrier substrate module, coupled to the microprocessor, comprising;
at least one semiconductor device;
a first flexible carrier substrate having a first and a second end and having a surface portion carrying a second set of conductive traces thereon, wherein the first and second end of the first flexible carrier substrate are mounted to the rigid substrate such that the second set of conductive traces are electrically coupled with the first set of conductive traces and wherein the first flexible carrier substrate exhibits a first radius; and
a second flexible carrier substrate having a first and second end and having a surface portion carrying a third set of conductive traces thereon, wherein the first and second end of the second flexible carrier substrate are mounted to the rigid substrate such that the third set of conductive traces are electrically coupled with the first set of conductive traces and wherein the second flexible carrier substrate exhibits a second radius different than the first radius. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. A computer system comprising:
-
an input device;
an output device;
a microprocessor coupled to the input device and the output device;
a rigid substrate; and
a flexible carrier substrate module, coupled to the microprocessor, comprising;
a first flexible carrier substrate having a first and a second end wherein the first and second ends of the first flexible carrier substrate are mounted to the rigid substrate;
a first semiconductor device mounted to the first flexible carrier substrate;
a second flexible carrier substrate having a first and a second end wherein the first and second ends of the second flexible carrier substrate are mounted to the rigid substrate such that the second flexible carrier substrate is superimposed over the first flexible carrier substrate; and
a second semiconductor device mounted to the second flexible carrier substrate. - View Dependent Claims (18)
-
Specification