Onboard multiphase electronic lapping guide design for MR heads

• US 6,786,803 B2
• Filed: 11/19/2002
• Issued: 09/07/2004
• Est. Priority Date: 11/19/2002
• Status: Expired due to Fees

• Current Assignee: Hitachi Global Storage Technologies Netherlands BV (Western Digital Corporation)
• Original Assignee: International Business Machines Corporation
• Inventors: Crawforth, Linden J., Wang, Benjamin L., Minvielle, Timothy J., Werner, Douglas J.
• Primary Examiner(s): Hail, III, Joseph J.
• Assistant Examiner(s): Thomas, David B.
• Application Number:
  US10/299,219
• Publication Number:
  US 20040097173A1
• Time in Patent Office: 658 Days
• Field of Search: 451/1, 451/5, 451/8-11, 451/28, 451/41, 296/030.1, 296/031.2, 296/031.5, 296/031.6, 295/93, 360/72, 360/103, 360/104
• US Class Current: 451/41
• CPC Class Codes: G11B 5/1871 Shaping or contouring of the transducing or guiding surface
• CPC Class Codes: G11B 5/39 using magneto-resistive devices or effects

Abstract

An onboard electronic lapping guide for lapping a magneto-resistive head having a magneto-resistive sensor element disposed for electrical communication with a pair of sensor electrical leads. The lapping guide includes an electronic lapping guide resistive element disposed for electrical communication with the sensor electrical leads. The resistive element has a predetermined height in a lapping direction and is adapted to produce an electrical resistance in the presence of a lapping current that increases as said resistive element height is reduced during lapping. A lapping method and a method of forming the onboard electronic lapping guide are also disclosed.

Claims

1. An onboard electronic lapping guide for lapping a magneto-resistive head having a magneto-resistive sensor element disposed for electrical communication with a pair of sensor electrical leads, said lapping guide comprising:

an electronic lapping guide resistive element disposed for electrical communication with said electrical leads and spaced from said sensor element in a lapping direction;

said resistive element having a predetermined height in a lapping direction; and

said resistive element being adapted to produce an electrical resistance in the presence of a lapping current that increases as said resistive element height is reduced during lapping.

2. A lapping guide in accordance with claim 1 wherein said resistive element is disposed between said sensor element and a portion of said head that will receive a lapping tool.

3. A lapping guide in accordance with claim 1 wherein there are two resistive elements providing a coarse lapping guide and a fine lapping guide.

4. A lapping guide in accordance with claim 3 wherein said coarse lapping guide has a greater width and height than said fine lapping guide.

5. A lapping guide in accordance with claim 3 wherein said coarse lapping guide is separated from said fine lapping guide by a gap that is of sufficient height to support a lapping clean-up phase.

6. A lapping guide in accordance with claim 3 wherein said fine lapping guide has a height corresponding to a height of said sensor element.

7. A lapping guide in accordance with claim 3 wherein said fine lapping guide has a width corresponding to a track width of said sensor element.

8. A lapping guide in accordance with claim 7 wherein said sensor electrical leads are shaped to define said width of said fine lapping guide and said track width of said sensor element, and to further define a width of said coarse lapping guide that is larger than said fine lapping guide width and said sensor element track width.

9. A lapping guide in accordance with claim 1 wherein said resistive element and said sensor element comprise identical thin film layers.

10. A lapping guide in accordance with claim 3 wherein said fine lapping guide, said coarse lapping guide and said sensor clement comprise identical thin film layers.

11. A method of lapping a magneto-resistive head having a magneto-resistive sensor element disposed for electrical communication with a pair of sensor electrical leads, comprising:

forming an electronic lapping guide resistive element disposed for electrical communication with said electrical leads and spaced from said sensor element in a lapping direction;

said resistive element having a predetermined height in a lapping direction;

said resistive element being adapted to produce an electrical resistance in the presence of a lapping current that increases as said resistive element height is reduced during lapping;

passing a lapping current through said resistive element;

lapping said head while monitoring changes in said electrical resistance.

12. A method in accordance with claim 11 wherein said resistive element is disposed between said sensor element and a lapping tool and wherein:

a lapping rate is calculated while lapping said resistive element; and

said lapping rate is used to lap said sensor element.

13. A method in accordance with claim 12 wherein there are two resistive elements providing a coarse lapping guide and a fine lapping guide, and wherein said lapping rate is determined from lapping said fine lapping guide.

14. A method in accordance with claim 13 wherein said coarse lapping guide has a greater width and height than said fine lapping guide.

15. A method in accordance with claim 13 wherein said coarse lapping guide is separated from said fine lapping guide by a gap and wherein said method includes a lapping clean up phase to remove smeared material after lapping said coarse lapping guide and before lapping said fine lapping guide.

16. A method in accordance with claim 13 wherein said fine lapping guide has a height corresponding to a height of said sensor element.

17. A method in accordance with claim 13 wherein said fine lapping guide has a width corresponding to a track width of said sensor element.

18. A method in accordance with claim 17 wherein said sensor electrical leads are shaped to define said width of said fine lapping guide and said track width of said sensor element, and to further define a width of said coarse lapping guide that is larger than said fine lapping guide width and said sensor element track width.

19. A method in accordance with claim 11 wherein said resistive element and said sensor element comprise identical thin film layers.

20. A method in accordance with claim 13 wherein said fine lapping guide, said coarse lapping guide and said sensor element comprise identical thin film layers.

21. A method of forming a magnetoresistive sensor with an onboard electronic lapping guide, comprising;

forming a plurality of sensor layers on a substrate;

photolithographically etching said sensor layers using a track width defining mask to create a pair of etched pockets;

forming a pair of sensor electrical leads in said etched pockets, said electrical leads being spaced from each other to define a sensor track width;

photolithographically etching said sensor layers to define a sensor element using a stripe height defining mask to remove sensor material outside said mask;

said stripe height defining mask further defining a lapping guide resistive element extending between said electrical leads and spaced from said sensor element in a lapping direction;

said resistive element having a predetermined height in a lapping direction; and

said resistive element being adapted to produce an electrical resistance in the presence of a lapping current that increases as said resistive element height is reduced during lapping.

22. A method in accordance with claim 21 wherein said resistive element is disposed between said sensor element and a portion of said sensor that will receive a lapping tool.

23. A method in accordance with claim 21 wherein there are two resistive elements providing a coarse lapping guide and a fine lapping guide.

24. A method in accordance with claim 23 wherein said coarse lapping guide has a greaser width and height than said fine lapping guide.

25. A method in accordance with claim 23 wherein said coarse lapping guide is separated from said fine lapping guide by a gap that is of sufficient height to support a lapping clean-up phase.

26. A method in accordance with claim 23 wherein said fine lapping guide has a height corresponding to a height of said sensor element.

27. A method accordance with claim 23 wherein said fine lapping guide has a width corresponding to a track width of said sensor element.

28. A method in accordance with claim 27 wherein said sensor electrical leads are shaped to define said width of said fine lapping guide and said track width of said sensor element, and to further define a width of said coarse lapping guide that is larger than said fine lapping guide width and said sensor element track width.

29. A method in accordance with claim 21 wherein said resistive element and said sensor element comprise identical thin film layers.

30. A method in accordance with claim 23 wherein said fine lapping guide, said coarse lapping guide and said sensor element comprise identical thin film layers.