Micromechanical device fabrication

• US 6,787,187 B2
• Filed: 12/31/2001
• Issued: 09/07/2004
• Est. Priority Date: 12/29/2000
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Jacobs, Simon Joshua
• Primary Examiner(s): CHEN, BRET P
• Application Number:
  US10/036,698
• Publication Number:
  US 20020132062A1
• Time in Patent Office: 981 Days
• Field of Search: 427/255.6, 427/99, 427/569, 427/154, 427/289
• US Class Current: 427/255.6
• CPC Class Codes: B81C 1/00896 Temporary protection during separation into individual elements
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

A method of fabricating a micromechanical device. Several of the micromechanical devices are fabricated 20 on a common wafer. After the devices are fabricated, the sacrificial layers are removed 22 leaving open spaces where the sacrificial layers once were. These open spaces allow for movement of the components of the micromechanical device. The devices optionally are passivated 24, which may include the application of a lubricant. After the devices have been passivated, they are tested 26 in wafer form. After testing 26, any surface treatments that are not compatible with the remainder of the processing steps are removed 28. The substrate wafer containing the completed devices receives a conformal overcoat 30. The overcoat layer is thick enough to project the micromechanical structures, but thin and light enough to prevent deforming the underlying micromechanical structures. Once the devices on the wafer are overcoated, the wafer is separated 32, and the known good devices are cleaned 34 to remove debris left by the dicing process. Once the devices are separated and cleaned, the overcoat may be removed, however, the overcoat typically is left in place to protect the device during the initial stages of the packaging process. Typically the devices are mounted 36 in the package substrate, the overcoat removed 38 from the devices, and the package containing the micromechanical device finished by sealing the package to enclose the device.

Claims

1. A method of fabricating a micromechanical device, the method comprising:

forming at least two micromechanical devices on a common substrate;

overcoating said micromechanical devices using vapor deposition;

separating said common substrate to separate said devices; and

removing said overcoat from said micromechanical devices.

2. The method of claim 1, said vapor deposition comprising:

providing a plasma of an organic gas;

generating reactive intermediaries of said plasma; and

depositing said reactive intermediaries on said micromechanical devices.

3. The method of claim 2, said organic gas comprising vinylic hydrocarbons.

4. The method of claim 2, said organic gas comprising fluorocarbons.

5. The method of claim 1, said vapor deposition comprising:

providing an organic gas;

exposing said organic gas to at least one electrical conductor held at a high voltage potential to generate reactive intermediaries of said organic gas; and

depositing said reactive intermediaries on said micromechanical devices.

6. The method of claim 5, said organic gas comprising vinylic hydrocarbons.

7. The method of claim 5, said organic gas comprising fluorocarbons.

8. The method of claim 1, said vapor deposition comprising:

providing an organic gas;

heating said organic gas to generate reactive intermediaries of said organic gas; and

depositing said reactive intermediaries on said micromechanical devices.

9. The method of claim 8, said organic gas comprising a p-xylylene polymer.

10. The method of claim 8, said organic gas comprising a fluorocarbon polymer.

11. The method of claim 8, said organic gas comprising hexafluoropropylene oxide.

12. The method of claim 1, said vapor deposition comprising:

providing an organic gas;

exposing said organic gas to a heated filament to generate reactive intermediaries of said organic gas; and

depositing said reactive intermediaries on said micromechanical devices.

13. The method of claim 12, said organic gas comprising a p-xylylene polymer.

14. The method of claim 12, said organic gas comprising a fluorocarbon polymer.

15. The method of claim 12, said organic gas comprising hexafluoropropylene oxide.

16. The method of claim 1, said overcoating comprising conformally overcoating said micromechanical device.

17. The method of claim 1, said overcoating comprising overcoating a micromirror device.

18. The method of claim 1, said forming comprising forming at least two micromechanical devices on a common silicon substrate.

19. The method of claim 1, comprising:

cleaning separation debris from said devices prior to said removing said overcoat from said micromechanical devices.

20. The method of claim 1, comprising:

testing said micromechanical devices prior to said overcoating.

21. The method of claim 1, said forming comprising forming at least two micromechanical devices having at least one moveable element, wherein said overcoating is sufficient to immobilize said moveable element.

22. A method of fabricating a micromechanical device, the method comprising:

forming at least two micromechanical devices on a common substrate;

providing a plasma of an organic gas;

generating reactive intermediaries of said plasma;

depositing an overcoat of said reactive intermediaries on said micromechanical devices;

separating said common substrate to separate said micromechanical devices; and

removing said overcoat from said micromechanical devices.

23. The method of claim 22, said organic gas comprising vinylic hydrocarbons.

24. The method of claim 22, said organic gas comprising fluorocarbons.

25. The method of claim 22, said forming comprising forming at least two micromechanical devices having at least one moveable element, wherein said depositing is sufficient to immobilize said moveable element.

26. A method of fabricating a micromechanical device, the method comprising:

forming at least two micromechanical devices on a common substrate;

providing an organic gas;

exposing said organic gas to at least one electrical conductor held at a high voltage potential to generate reactive intermediaries of said organic gas;

depositing said reactive intermediaries on said micromechanical devices;

separating said common substrate to separate said micromechanical devices; and

removing said overcoat from said micromechanical devices.

27. The method of claim 26, said organic gas comprising vinylic hydrocarbons.

28. The method of claim 26, said organic gas comprising fluorocarbons.

29. The method of claim 26, said forming comprising forming at least two micromechanical devices having at least one moveable element, wherein said depositing is sufficient to immobilize said moveable element.

30. A method of fabricating a micromechanical device, the method comprising:

forming at least two micromechanical devices on a common substrate;

providing an organic gas;

heating said organic gas to generate reactive intermediaries of said organic gas;

depositing said reactive intermediaries on said micromechanical devices;

separating said common substrate to separate said micromechanical devices; and

removing said overcoat from said micromechanical devices.

31. The method of claim 30, said organic gas comprising a p-xylylene polymer.

32. The method of claim 30, said organic gas comprising a fluorocarbon polymer.

33. The method of claim 30, said organic gas comprising hexafluoropropylene oxide.

34. The method of claim 30, said forming comprising forming at least two micromechanical devices having at least one moveable element, wherein said depositing is sufficient to immobilize said moveable element.

35. A method of fabricating a micromechanical device, the method comprising:

forming at least two micromechanical devices on a common substrate;

providing an organic gas;

exposing said organic gas to a heated filament to generate reactive intermediaries of said organic gas;

depositing said reactive intermediaries on said micromechanical devices;

separating said common substrate to separate said micromechanical devices; and

removing said overcoat from said micromechanical devices.

36. The method of claim 35, said organic gas comprising a p-xylylene polymer.

37. The method of claim 35, said organic gas comprising a fluorocarbon polymer.

38. The method of claim 35, said organic gas comprising hexafluoropropylene oxide.

39. The method of claim 35, said forming comprising forming at least two micromechanical devices having at least one moveable element, wherein said depositing is sufficient to immobilize said moveable element.