Functional device, method of manufacturing therefor and driver circuit

• US 6,787,384 B2
• Filed: 09/03/2003
• Issued: 09/07/2004
• Est. Priority Date: 08/17/2001
• Status: Expired due to Fees

• Current Assignee: DENSO Corporation
• Original Assignee: NEC Corporation
• Inventors: Okumura, Toshiyuki
• Primary Examiner(s): Dang, Phuc T.
• Application Number:
  US10/653,810
• Publication Number:
  US 20040042287A1
• Time in Patent Office: 370 Days
• Field of Search: 438/53, 438/54, 438/61, 438/65, 438/103, 438/106, 438/110
• US Class Current: 438/53
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 3/001 Bonding of two components
• CPC Class Codes: G02B 2006/12104 Mirror; Reflectors or the like
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 6/12007 forming wavelength selective elements, e.g. multiplexer, demultiplexer
• CPC Class Codes: G02B 6/29358 Multiple beam interferometer external to a light guide, e.g. Fabry-Pérot, etalon, VIPA plate, OTDL plate, continuous interferometer, parallel plate resonator G02B6/29347, G02B6/29349, G02B6/2935, G02B6/29361 take precedence; resonator evanescently coupled to light guide G02B6/29335
• CPC Class Codes: G02B 6/29361 Interference filters, e.g. multilayer coatings, thin film filters, dichroic splitters or mirrors based on multilayers, WDM filters
• CPC Class Codes: G02B 6/29362 Serial cascade of filters or filtering operations, e.g. for a large number of channels
• CPC Class Codes: G02B 6/29395 configurable, e.g. tunable or reconfigurable switching G02B6/35
• CPC Class Codes: G02B 6/3518 the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device MEMS devices in general B81B; manufacture of MEM devices in general B81C; micromechanical devices controlling the direction of light G02B26/0833
• CPC Class Codes: G02B 6/352 the reflective optical element having a shaped reflective surface, e.g. a reflective element comprising several reflective surfaces or facets that function together
• CPC Class Codes: G02B 6/3546 NxM switch, i.e. a regular array of switches elements of matrix type constellation
• CPC Class Codes: G02B 6/3556 NxM switch, i.e. regular arrays of switches elements of matrix type constellation
• CPC Class Codes: G02B 6/356 in an optical cross-connect device, e.g. routing and switching aspects of interconnecting different paths propagating different wavelengths to (re)configure the various input and output links switching polarized beams G02B6/3594; power equalizers G02B6/356 and G02B6/3594; path selecting means H04Q11/0001
• CPC Class Codes: G02B 6/357 Electrostatic force electrostatic forces controlling reflecting elements in general G02B26/0841
• CPC Class Codes: G02B 6/3584 constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching MEMS per se B81B, B81C
• CPC Class Codes: G02B 6/3588 : of the processed beams, i.e. controlling during switching of orientation, alignment, or beam propagation properties such as intensity, size or shape
• CPC Class Codes: G02B 6/3594 : Characterised by additional functional means, e.g. means for variably attenuating or branching or means for switching differently polarized beams
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A driver circuit substrate is prepared and a mirror substrate is so provided as to be placed on the driver circuit substrate. Nine mirror elements are lad out on the mirror substrate in a 3×3 matrix form. The mirror elements are prepared by a microelectromechanical system (MEMS). An insulating substrate is provided on the driver circuit substrate and a driver circuit which drives a light reflecting mirror element is provided on the insulating substrate. The driver circuit substrate is connected to the mirror substrate via a resin layer of a thermosetting adhesive or the like.

Claims

1. A method of manufacturing for a functional device comprising the steps of:

forming a processing element and a microelectromechanical section for supporting said processing element said processing element in a movable manner on a silicon substrate;

forming a through hole in an insulating substrate;

forming a first electrode on a first side of said insulating substrate and a second electrode on a second side of said insulating substrate, said second electrode being connected to said first electrode via said through hole;

preparing a functional-element movably supporting structure by joining said processing element and said microelectromechanical section to said insulating substrate;

preparing a driver circuit substrate by forming on a substrate a driver circuit which drives a functional-element; and

joining said functional-element movably supporting structure to said driver circuit substrate in such a way that said driver circuit is connected to said second electrode.

2. The method of manufacturing according to claim 1, wherein joining of said functional-element movably supporting structure to said driver circuit substrate is carried out via a joining layer which has an insulating layer, formed of an insulating material, for joining said functional-element to said driver circuit substrate and connection terminals, provided in said insulating layer for connecting said functional-element to said driver circuit.