Vertical type power mosfet having trenched gate structure

• US 6,787,848 B2
• Filed: 07/01/2002
• Issued: 09/07/2004
• Est. Priority Date: 06/29/2001
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Kawaguchi, Yusuke, Ono, Syotaro
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): FORDE, REMMON R
• Application Number:
  US10/184,974
• Publication Number:
  US 20030001203A1
• Time in Patent Office: 799 Days
• Field of Search: 257/328, 257/327, 257/329, 257/330, 257/333, 257/341, 257/342, 438/212, 438/268, 438/259, 438/270
• US Class Current: 257/328
• CPC Class Codes: H01L 29/0847 of field-effect transistors with insulated gate H01L29/0653 takes precedence; with a passive supplementary region between source or drain and substrate related to punch-through, capacity or isolation phenomena H01L29/1079; with LDD or DDD structure H01L29/7833; for thin film transistors H01L29/78618
• CPC Class Codes: H01L 29/0878 Impurity concentration or distribution
• CPC Class Codes: H01L 29/42368 the thickness being non-uniform
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236
• CPC Class Codes: H01L 29/7828 without inversion channel, e.g. vertical ACCUFETs, normally-on vertical MISFETs

Abstract

A power MOSFET comprising a drain layer of a first conductivity type, a drift layer of the first conductivity type provided on the drain layer, a base layer of a first or a second conductivity type provided on the drift layer, a source region of the first conductivity type provided on the base layer, a gate insulating film formed on an inner wall surface of a trench penetrating the base layer and reaching at the drift layer, and a gate electrode provided on the gate insulating film inside the trench, wherein the gate insulating film is formed such that a portion thereof adjacent to the drift layer is thicker than a portion thereof adjacent to the base layer, and the drift layer has an impurity concentration gradient higher in the vicinity of the drain layer and lower in the vicinity of the source region along a depth direction of trench.

Claims

1. A power MOSFET comprising:

a drain layer of a first conductivity type;

a drift layer of the first conductivity type provided on said drain layer;

a base layer of a second conductivity type provided on said drift layer;

a source region of the first conductivity type provided on said base layer;

a gate insulating film formed on an inner wall surface of a trench penetrating the base layer and said drift layer and having a bottom portion reaching into the drain layer; and

a gate electrode provided on said gate insulating film inside said trench, wherein

said gate insulating film is formed such that a portion thereof adjacent to said drift layer is thicker than a portion thereof adjacent to said base layer, and said drift layer has an impurity concentration gradient higher in the vicinity of said drain layer and lower in the vicinity of said source region along a depth direction of the trench.

2. The power MOSFET according to claim 1, wherein the impurity concentration of said drift layer is in the range between 1×

10¹⁶ and 9×

10¹⁶/cms³ in the portion adjacent to base layer, and is in the range between 1×

10¹⁷ and 3×

10¹⁷/cm³ in a portion adjacent to the drain layer.

3. The power MOSFET according to claim 1, wherein said drift layer has a portion in which the impurity concentration of said first conductivity type along a depth direction of the trench is of a minimum value.

4. The power MOSFET according to claim 3, wherein the impurity concentration of said drift layer is in the range between 1×

10¹⁷ and 3×

10¹⁷/cm³ in the portion adjacent to said base layer, and is in the range between 1×

10¹⁶ and 9×

10¹⁶/cm³ in the portion having the minimum impurity concentration value, and is in the range between 1×

10¹⁷ and 3×

10¹⁷/cm³ in a portion adjacent to said drain layer.

5. The power MOSFET according to claim 1, wherein a width of said base layer disposed between a pair of the gate insulating films adjacent to each other is equal to or less than 0.5 μ

m.

6. The power MOSFET according to claim 2, wherein a width of said base layer disposed between a pair of the gate insulating films adjacent to each other is equal to or less than 0.5 μ

m.

7. The power MOSFET according to claim 3, wherein a width of said base layer disposed between a pair of the gate insulating films adjacent to each other is equal to or less than 0.5 μ

m.

8. The power MOSFET according to claim 4, wherein a width of said base layer disposed between a pair of the gate insulating films adjacent to each other is equal to or less than 0.5 μ

m.

9. The power MOSFET according to claim 1, wherein said gate insulating film reaches at said drain layer.

10. The power MOSFET according to claim 2, wherein said gate insulating film reaches at said drain layer.

11. The power MOSFET according to claim 3, wherein said gate insulating film reaches at said drain layer.

12. The power MOSFET according to claim 4, wherein said gate insulating film reaches at said drain layer.

13. The power MOSFET according to claim 1, wherein said gate insulating film has portions facing said base layer with similar thickness, and portions facing said drift layer with similar thickness.

14. The power MOSFET according to claim 1, wherein said gate insulating film has portions facing said base layer with similar thickness, and portions facing said drift layer with a thickness increasing from said base layer to said drain layer.

15. The power MOSFET according to claim 1, wherein said gate insulating film has portions facing said base layer with similar thickness, and portions facing said drift layer with a thickness increasing in a step like fashion from said base layer to said drain layer.

16. A power MOSFET comprising:

a drain layer of a first conductivity type;

a drift layer of the first conductivity type provided on said drain layer;

a base layer of the first conductivity type provided on said drift layer;

a source region of the first conductivity type provided on said base layer;

a gate insulating film formed on an inner wall surface of a trench penetrating the base layer and reaching at said drift layer to have a bottom portion formed in the drift layer; and

a gate electrode provided on said gate insulating film inside said trench, wherein

said gate insulating film is formed such that a portion thereof adjacent to said drift layer is thicker than a portion thereof adjacent to said base layer, and said drift layer has a step shaped impurity concentration gradient higher in the vicinity of said drain layer and lower in the vicinity of said source region along a depth direction of the trench.

17. The power MOSFET according to claim 16, wherein the impurity concentration of said drift layer is in the range between 1×

10¹⁶ and 9×

10¹⁶/cm³ in the portion adjacent to said base layer, and is in the range between 1×

10¹⁷ and 3×

10¹⁷/cm³ in a portion adjacent to said drain layer.

18. The power MOSFET according to claim 16, wherein said drift layer has a portion in which the impurity concentration of said first conductivity type along a depth direction of the trench is of minimum value.

19. The power MOSFET according to claim 18, wherein the impurity concentration of said drift layer is in the range between 1×

10¹⁷ and 3×

10¹⁷/cm³ in the portion adjacent to said base layer, and is in the range between 1×

10¹⁶ and 9×

10¹⁶/cm³ in the portion having the minimum impurity concentration value, and is in the range between 1×

10¹⁷ and 3×

10¹⁷/cm³ in a portion adjacent to said drain layer.

20. The power MOSFET according to claim 16, wherein a width of said base layer disposed between a pair of the gate insulating films adjacent to each other is equal to or less than 0.5 μ

m.

21. The power MOSFET according to claim 17, wherein a width of said base layer disposed between a pair of the gate insulating films adjacent to each other is equal to or less than 0.5 μ

m.

22. The power MOSFET according to claim 18, wherein a width of said base layer disposed between a pair of the gate insulating films adjacent to each other is equal to or less than 0.5 μ

m.

23. The power MOSFET according to claim 19, wherein a width of said base layer disposed between a pair of the gate insulating films adjacent to each other is equal to or less than 0.5 μ

m.

24. The power MOSFET according to claim 16, wherein said gate insulating film reaches at said drain layer.

25. The power MOSFET according to claim 17, wherein said gate insulating film reaches at said drain layer.

26. The power MOSFET according to claim 18, wherein said gate insulating film reaches at said drain layer.

27. The power MOSFET according to claim 19, wherein said gate insulating film reaches at said drain layer.

28. The power MOSFET according to claim 16, wherein said gate insulating film has portions facing said base layer with similar thickness, and portions facing said drift layer with similar thickness.

29. The power MOSFET according to claim 16, wherein said gate insulating film has portions facing said base layer with similar thickness, and portions facing said drift layer with a thickness increasing from said base layer to said drain layer.

30. The power MOSFET according to claim 16, wherein said gate insulating film has portions facing said base layer with similar thickness, and portions facing said drift layer with a thickness increasing in a step like fashion from said base layer to said drain layer.

31. A power MOSFET comprising:

a drain layer of a first conductivity type;

a drift layer of the first conductivity type provided on the drain layer;

a base layer of second conductivity type provided on said drift layer;

a source region of the first conductivity type provided on said base layer;

a gate insulating film formed on an inner wall surface of a trench penetrating the base layer and reaching the drift layer to have a bottom portion formed within the drift layer; and

a gate electrode provided on said gate insulating film inside said trench, wherein

said gate insulating film is formed such that a portion thereof adjacent to the drift layer is thicker than a portion thereof adjacent to the base layer, and said drift layer has a V-shaped impurity concentration gradient distribution having a peak point near the base layer and another peak point near the drain layer and having a portion in which the impurity concentration of the first conductivity type along a depth direction of the trench is at a minimum value between the peak points.

32. The power MOSFET according to claim 31, wherein the impurity concentration of said drift layer is in the range between 1×

10¹⁶ and 9×

10¹⁶/cm³ in the portion adjacent to base layer, and is in the range between 1×

10¹⁷ and 3×

10¹⁷/cm³ in a portion adjacent to the drain layer.

33. The power MOSFET according to claim 31, wherein the impurity concentration of said drift layer is in the range between 1×

10¹⁶ and 3×

10¹⁷/cm³ in the portion adjacent to base layer, and is in the range between 1×

10¹⁶ and 9×

10¹⁶/cm³ in the portion having the minimum value, and is in the range between 1×

10¹⁷ and 3×

10¹⁷/cm³ in a portion adjacent to the drain layer.

34. The power MOSFET according to claim 31, wherein a width of said base layer disposed between a pair of the gate insulating films adjacent to each other is equal to or less than 0.5 μ

m.

35. The power MOSFET according to claim 31, wherein said gate insulating film has portions facing said base layer with similar thickness, and portions facing said drift layer with similar thickness.

36. The power MOSFET according to claim 31, wherein said gate insulating film has portions facing said base layer with similar thickness, and portions facing said drift layer with a thickness increasing from said base layer to said drain layer.

37. The power MOSFET according to claim 31, wherein said gate insulating film has portions facing said base layer with similar thickness, and portions facing said drift layer with a thickness increasing in a step fashion from said base layer to said drain layer.

38. A power MOSFET comprising:

a drain layer of a first conductivity type;

a drift layer of the first conductivity type provided on the drain layer;

a base layer of second conductivity type provided on said drift layer;

a source region of the first conductivity type provided on said base layer;

a gate insulating film formed on an inner wall surface of a trench penetrating the base layer and reaching the drift layer to have a bottom portion formed in the drift layer; and

a gate electrode provided on said gate insulating film inside said trench, wherein

said gate insulating film is formed such that a portion thereof adjacent to the drift layer is thicker than a portion thereof adjacent to the base layer, and said drift layer has a step shaped impurity concentration distribution having a gradient higher in the vicinity of said drain layer and lower in the vicinity of said source region along a depth direction of the trench.

39. The power MOSFET according to claim 38, wherein the impurity concentration of said drift layer is in the range between 1×

10¹⁶ and 9×

10¹⁶/cm³ in the portion adjacent to base layer, and is in the range between 1×

10¹⁷ and 3×

10¹⁷/cm³ in a portion adjacent to the drain layer.

40. The power MOSFET according to claim 38, wherein a width of said base layer disposed between a pair of the gate insulating films adjacent to each other is equal to or less than 0.5 μ

m.

41. The power MOSFET according to claim 38, wherein said gate insulating film has portions facing said base layer with similar thickness, and portions facing said drift layer with similar thickness.

42. The power MOSFET according to claim 38, wherein said gate insulating film has portions facing said base layer with similar thickness, and portions facing said drift layer with a thickness increasing from said base layer to said drain layer.

43. The power MOSFET according to claim 38, wherein said gate insulating film has portions facing said base layer with similar thickness, and portions facing said drift layer with a thickness increasing in a step fashion from said base layer to said drain layer.