Semiconductor component with integrated circuit, cooling body, and temperature sensor
First Claim
1. A semiconductor component comprising an integrated circuit (1) thermally connected to a temperature sensor (7) whose resistance is dependent on temperature, and a cooling body (13) provided as a heat sink, wherein the temperature sensor (7) comprises a thin film measuring resistor (15) applied to an electrically insulating surface of a foil-form substrate (16), has a total thickness in a range of about 10 to 100 μ
- m, and is thermally coupled to the cooling body (13).
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Accused Products
Abstract
A semiconductor component with an integrated circuit has a cooling body as a heat sink and a temperature sensor thermally connected thereto, whose resistance is dependent on temperature. The temperature sensor contains a thin film measuring resistor, which is applied to an electrically insulating surface of a foil-like substrate, and the total thickness of the temperature sensor lies in a range of about 10 μm to 100 μm. The thin film measuring resistor is formed as a planar component, with the temperature sensor being arranged between the integrated circuit and the cooling body. The thin film measuring resistor is provided on one side with a thermal coupling layer bordering on the cooling body, while on the other side the resistor has a substrate bordering on a heat distributor, which at least partially surrounds the integrated circuit.
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Citations
15 Claims
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1. A semiconductor component comprising an integrated circuit (1) thermally connected to a temperature sensor (7) whose resistance is dependent on temperature, and a cooling body (13) provided as a heat sink, wherein the temperature sensor (7) comprises a thin film measuring resistor (15) applied to an electrically insulating surface of a foil-form substrate (16), has a total thickness in a range of about 10 to 100 μ
- m, and is thermally coupled to the cooling body (13).
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
Specification