LED matrix moldule

• US 6,788,541 B1
• Filed: 05/07/2003
• Issued: 09/07/2004
• Est. Priority Date: 05/07/2003
• Status: Expired due to Fees

• Current Assignee: Bear Hsiung
• Original Assignee: Bear Hsiung
• Inventors: Hsiung, Bear
• Primary Examiner(s): Vortman, Anatoly
• Application Number:
  US10/430,398
• Time in Patent Office: 489 Days
• Field of Search: 361/704-712, 361/717-719, 257/705-707, 257/712, 257/713, 257/720, 257/796, 116/202, 313/498-500
• US Class Current: 361/719
• CPC Class Codes: F21V 21/096 Magnetic devices
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

An LED matrix module of the invention has a circuit board, a thermally conductive plate and a plurality of LED chips. A plurality of slots is formed through a circuit surface and a bonding surface of the circuit board. A positive trace and a negative trace respectively extend from an edge of the circuit board. The thermally conductive plate is attached onto the bonding surface of the circuit board. The LED chips are respectively mounted through the slots of the circuit board in a manner to attach on the thermally conductive plate. Each LED chip is further electrically connected to the positive and negative traces on the circuit surface of the circuit board respectively via a positive electrode wire and a negative electrode wire. The LED chips are directly attached onto the thermally conductive plate through which the heat dissipates. The high brightness of the LED is thereby ensured.

Claims

1. An LED (light emitting diode) matrix module, comprising

a circuit board, having a circuit surface and a bonding surface opposite the circuit surface, a plurality of slots being formed through the circuit surface and the bonding surface, wherein a positive trace and a negative trace respectively extend from an edge of the circuit board;

a thermally conductive plate, attached onto the bonding surface of the circuit board; and

a plurality of LED chips, respectively mounted through the slots of the circuit board in a manner to attach onto the thermally conductive plate, wherein each LED chip is further electrically connected to the positive and negative traces on the circuit surface of the circuit board respectively via a positive electrode wire and a negative electrode wire.

2. The LED matrix module of claim 1, wherein the circuit board is a bi-layered circuit board.

3. The LED matrix module of claim 1, wherein the circuit board is a multi-layered circuit board.

4. The LED matrix module of claim 1, wherein the thermally conductive plate is a metallic plate with a reflective anti-oxidation material applied thereon.

5. The LED matrix module of claim 1, wherein a thermally conductive paste is applied between the respective LED chips and the thermally conductive plate.

6. The LED matrix module of claim 1, wherein a transparent paste respectively encapsulates the LED chips, the positive electrode wire and the negative electrode wire.

7. The LED matrix module of claim 1, wherein the circuit surface of the circuit board is further provided with a square focus lens located corresponding to the LED chips.

8. The LED matrix module of claim 1, wherein said LED matrix module is one of a plurality of LED matrix modules, and wherein the positive trace and the negative trace extended from one circuit board of one LED matrix module respectively connect to those from another circuit board of another LED matrix module.

9. The LED matrix module of claim 1, wherein said LED matrix module is one of a plurality of LED matrix modules, and wherein a magnet is further mounted on the thermally conductive plate opposite the circuit board, whereby magnets of neighboring circuit boards of others LED matrix modules are attached to one another by magnetic attraction and then bonded by soldering.