Sorting a group of integrated circuit devices for those devices requiring special testing

• US 6,788,993 B2
• Filed: 03/03/2003
• Issued: 09/07/2004
• Est. Priority Date: 02/17/1997
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Beffa, Raymond J.
• Primary Examiner(s): PATEL, RAMESH B
• Application Number:
  US10/379,257
• Publication Number:
  US 20030139839A1
• Time in Patent Office: 554 Days
• Field of Search: 700/115-117, 700/95, 700/96, 700/108, 700/109, 700/213, 700/121, 700/215, 250/306, 250/492.1, 250/234, 250/391.1, 250/492.2, 250/492.3, 250/307, 250/233, 257/712, 257/777, 341/133, 341/134, 341/154, 232/281, 232/313, 232/907, 702/118, 702/119, 702/82, 438/14-17, 438/10, 438/5
• US Class Current: 700/121
• CPC Class Codes: G01R 31/2894 Aspects of quality control [QC] G01R31/31718 takes precedence; program control for QC G05B19/41875
• CPC Class Codes: G01R 31/31718 Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis mechanical aspects G01R31/2808, G01R31/2851
• CPC Class Codes: G01R 31/319 Tester hardware, i.e. output processing circuits
• CPC Class Codes: G06F 11/006 Identification G06F11/2289 takes precedence
• CPC Class Codes: H01L 21/67271 Sorting devices
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2223/5444 for electrical read out

Abstract

A method for sorting integrated circuit (IC) devices of the type having a fuse identification (ID) into those devices requiring enhanced reliability testing and those requiring standard testing includes storing fabrication deviation data, probe data, and test data in association with the fuse ID of each of the devices indicating each of the devices requires either enhanced reliability testing or standard testing. The fuse ID of each of the devices is then automatically read before, during, or after standard testing of the devices. The testing process requirement data stored in association with the fuse ID of each of the devices is then accessed, and the devices are sorted in accordance with the accessed data into those devices requiring enhanced reliability testing and those requiring standard testing.

Claims

1. A manufacturing process for grouping a plurality of integrated circuit devices of a type having an identification code into a group of integrated circuit devices to undergo a first process and another group of integrated circuit devices to undergo a second process different than the first process after an inspection process of integrated circuit devices, the manufacturing process comprising:

storing data in association with an individual identification code of each of the integrated circuit devices indicating each of the integrated circuit devices undergoes one of the first process and the second process, the data including at least one of fabrication deviation data, probe data, standard test data, special test data, and enhanced reliability testing data in association with the individual identification code of at least some of the integrated circuit devices;

reading the individual identification code of each of the integrated circuit devices;

accessing the data stored in association with the individual identification code of each of the integrated circuit devices; and

grouping the integrated circuit devices in accordance with the accessed data into those integrated circuit devices to undergo the first process and those integrated circuit devices to undergo the second process.

2. The process of claim 1, wherein storing data comprises storing a Quality Deviation Report (QDR).

3. The process of claim 1, wherein storing data comprises storing data indicating one or more semiconductor wafers having integrated circuit devices have been misprocessed.

4. The process of claim 1, wherein storing data comprises storing data indicating one or more semiconductor wafers having integrated circuit devices have relatively low yields.

5. The process of claim 1, wherein storing data comprises storing data indicating one or more semiconductor wafer lots having integrated circuit devices have relatively low yields.

6. The process of claim 1, wherein the integrated circuit devices come from a plurality of die locations on each of a plurality of semiconductor wafers, and wherein storing data comprises storing data indicating that integrated circuit devices from identical die locations on each of a series of the plurality of semiconductor wafers have relatively low yields.

7. The process of claim 1, wherein the integrated circuit devices come from a plurality of semiconductor wafers each fabricated on one of a plurality of pieces of fabrication equipment, and wherein storing data comprises storing data indicating that a series of the plurality of semiconductor wafers fabricated using a same piece of fabrication equipment has relatively low yields.

8. The process of claim 1, wherein the integrated circuit devices come from a plurality of semiconductor wafers each tested on one of a plurality of pieces of test equipment, and wherein storing data comprises storing data indicating that a group of the plurality of semiconductor wafers tested using a same piece of test equipment has relatively low yields.

9. The process of claim 1, wherein the first and second processes comprise respective standard and special testing processes, and wherein storing data comprises storing special test data indicating that integrated circuit devices previously indicated to require the special testing process instead require the standard testing process.

10. The process of claim 1, wherein storing data in association with the individual identification code of each of the integrated circuit devices comprises storing data in association with the individual identification code of one or more integrated circuit devices other than those integrated circuit devices that are in the plurality of integrated circuit devices to be grouped, the other integrated circuit devices being at a different point in the integrated circuit manufacturing process than the integrated circuit devices in the plurality of integrated circuit devices to be grouped.

11. The process of claim 1, wherein reading the individual identification code of each of the integrated circuit devices comprises electrically retrieving a unique fuse identification programmed into each of the integrated circuit devices.

12. The process of claim 1, wherein reading the individual identification code of each of the integrated circuit devices comprises optically reading a unique identification code provided on each of the integrated circuit devices.

13. The process of claim 12, wherein optically reading a unique identification code provided on each of the integrated circuit devices comprises optically reading a unique laser fuse identification programmed into each of the integrated circuit devices.

14. The process of claim 1, wherein grouping the integrated circuit devices in accordance with the accessed data into those integrated circuit devices to undergo the first process and those integrated circuit devices to undergo the second process comprises sorting the integrated circuit devices before a standard testing process into those integrated circuit devices requiring an enhanced reliability testing process and those integrated circuit devices requiring the standard testing process.

15. The process of claim 1, wherein grouping the integrated circuit devices in accordance with the accessed data into those integrated circuit devices to undergo the first process and those integrated circuit devices to undergo the second process comprises sorting the integrated circuit devices during a standard testing process into those integrated circuit devices requiring an enhanced reliability testing process and those integrated circuit devices requiring the standard testing process.

16. The process of claim 1, wherein grouping the integrated circuit devices in accordance with the accessed data into those integrated circuit devices to undergo the first process and those integrated circuit devices to undergo the second process comprises sorting the integrated circuit devices after a standard testing process into those integrated circuit devices requiring an enhanced reliability testing process and those integrated circuit devices finished with testing.

17. The process of claim 1, wherein accessing the data comprises accessing one of fabrication equipment data, fabrication personnel data, fabrication set-up data, time and date data, yield data, and test data.

18. The process of claim 1, wherein each of the integrated circuit devices has an associated lot identification, and wherein accessing the data comprises accessing data associated with the lot identification of an integrated circuit device that is associated with each of the read identification codes.

19. An inspection process for integrated circuit devices from semiconductor wafers in a manufacturing process for integrated circuit devices, the inspection process comprising:

providing a plurality of semiconductor wafers;

fabricating a plurality of integrated circuit devices on each of the semiconductor wafers;

causing each of the integrated circuit devices on each of the semiconductor wafers to store an individual identification code;

separating each of the integrated circuit devices on each of the semiconductor wafers to form one of a plurality of integrated circuit devices;

storing data in association with the individual identification code associated with each of the integrated circuit devices that indicates each of the integrated circuit devices to undergo one of a first process and a second process, storing of data including storing an individual identification code by programming each of the integrated circuit devices on each of the semiconductor wafers to permanently store a unique fuse identification;

reading the individual identification code associated with each of the separated integrated circuit devices;

accessing the data stored in association with the individual identification code that is associated with each of the separated integrated circuit devices;

grouping the integrated circuit devices in accordance with the accessed data into those integrated circuit devices to undergo the first process and those integrated circuit devices to undergo the second process; and

testing the grouped integrated circuit devices using the first process and the second process.

20. The process of claim 19, wherein programming each of the integrated circuit devices on each of the semiconductor wafers to permanently store the unique fuse identification comprises programming at least one of fuses and antifuses in each of the integrated circuit devices on each of the semiconductor wafers to permanently store a unique fuse identification indicating at least one of a lot identification, work week, wafer identification, die location, and fabrication facility identification;

and

further comprising causing the grouped integrated circuit devices to advance through the first process and the second process according to their grouping.

21. The process of claim 19, wherein the integrated circuit devices modules are selected from a group comprising Single In-Line Memory Modules (SIMMs) and Dual In-line Memory Modules (DIMMs).

22. An integrated circuit manufacturing process for separating integrated circuit devices to undergo special testing from a group of integrated circuit devices undergoing standard test procedures, the integrated circuit devices being of the type to have an identification code, the process comprising:

storing data in association with an individual identification code of each of the integrated circuit devices indicating each of the integrated circuit devices undergoes one of special testing and standard testing;

reading the individual identification code of each of the integrated circuit devices;

accessing the data stored in association with the individual identification code of each of the integrated circuit devices; and

sorting the integrated circuit devices during the standard testing in accordance with the accessed data for those integrated circuit devices undergoing the special testing.

23. An integrated circuit manufacturing process for separating integrated circuit devices undergoing special testing from a group of integrated circuit devices undergoing standard test procedures, the integrated circuit devices having an identification code, the process comprising:

storing fabrication deviation data in association with an individual identification code of at least one of the integrated circuit devices indicating the at least one integrated circuit device undergoes the special testing;

reading the individual identification code of the at least one integrated circuit device;

accessing the fabrication deviation data stored in association with the individual identification code of the at least one integrated circuit device; and

sorting the integrated circuit devices in accordance with the accessed data for the at least one integrated circuit device undergoing the special testing.

24. An integrated circuit manufacturing process for separating integrated circuit devices undergoing special testing from a group of integrated circuit devices that have undergone standard test procedures, the integrated circuit devices having an identification code, the process comprising:

storing data in association with an individual identification code of at least one of the integrated circuit devices that indicates the at least one integrated circuit device undergoes the special testing;

reading the individual identification code of the at least one integrated circuit device;

accessing the data stored in association with the individual identification code of the at least one integrated circuit device; and

sorting the integrated circuit devices in accordance with the accessed data for the at least one integrated circuit device undergoing the special testing.

25. An integrated circuit manufacturing process for using special test data generated by a first group of integrated circuit devices undergoing special testing to sort a second group of integrated circuit devices into those integrated circuit devices to undergo the special testing and those integrated circuit devices to undergo standard testing after the inspection of the integrated circuit devices, the integrated circuit devices having an identification code, the process comprising:

storing data in association with an individual identification code of at least one of the second group of integrated circuit devices indicating the at least one of the second group of integrated circuit devices undergoes the special testing;

storing special test data generated by the first group of integrated circuit devices in association with the individual identification code of the at least one of the second group of integrated circuit devices indicating the at least one of the second group of integrated circuit devices undergoes the standard testing instead of the special testing;

reading the individual identification code of the at least one of the second group of integrated circuit devices;

accessing the data stored in association with the individual identification code of the at least one of the second group of integrated circuit devices; and

sorting the second group of integrated circuit devices in accordance with the accessed data so the at least one of the second group of integrated circuit devices undergoes the standard testing.