Microneedle array module and method of fabricating the same
First Claim
1. A method of fabricating a microneedle array module comprising the steps of:
- providing etch resistant mask layers to one and another opposite surfaces of a substrate to predetermined thicknesses;
patterning the etch resistant mask layer of the one surface for outer dimensions of the microneedles of said array;
patterning the etch resistant mask layer of the other surface for inner dimensions of the microneedles of said array;
etching unmasked portions of said substrate from one and the other surfaces to first and second predetermined depths, respectively; and
removing the mask layers from the one and the other surfaces.
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Abstract
A microneedle array module is disclosed comprising a multiplicity of microneedles affixed to and protruding outwardly from a front surface of a substrate to form the array, each microneedle of the array having a hollow section which extends through its center to an opening in the tip thereof. A method of fabricating the microneedle array module is also disclosed comprising the steps of: providing etch resistant mask layers to one and another opposite surfaces of a substrate to predetermined thicknesses; patterning the etch resistant mask layer of the one surface for outer dimensions of the microneedles of the array; patterning the etch resistant mask layer of the other surface for inner dimensions of the microneedles of the array; etching unmasked portions of the substrate from one and the other surfaces to first and second predetermined depths, respectively; and removing the mask layers from the one and the other surfaces. One embodiment of the method includes the steps of: providing an etch resistant mask layer to the other surface of the substrate to a predetermined thickness; patterning the etch resistant mask layer of the other surface to define a reservoir region in the substrate; and etching away the unmasked reservoir region of the substrate to form a reservoir well in the other surface of the substrate. A layer of material may be provided to the other surface to enclose the reservoir well and a passageway is provided through the layer to the well region.
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Citations
20 Claims
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1. A method of fabricating a microneedle array module comprising the steps of:
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providing etch resistant mask layers to one and another opposite surfaces of a substrate to predetermined thicknesses;
patterning the etch resistant mask layer of the one surface for outer dimensions of the microneedles of said array;
patterning the etch resistant mask layer of the other surface for inner dimensions of the microneedles of said array;
etching unmasked portions of said substrate from one and the other surfaces to first and second predetermined depths, respectively; and
removing the mask layers from the one and the other surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
providing an etch resistant mask layer to the other surface of the substrate to a predetermined thickness;
patterning the etch resistant mask layer of the other surface to define a reservoir region in the substrate; and
etching away the unmasked reservoir region of the substrate to form a reservoir well in the other surface of the substrate.
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18. The method of claim 17 including the steps of:
- providing a layer of material to the other surface to enclose the reservoir well; and
providing a passageway through said layer to the well region.
- providing a layer of material to the other surface to enclose the reservoir well; and
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19. The method of claim 18 including the reservoir well is enclosed by bonding a layer of material to the other surface.
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20. The method of claim 19 wherein the material of the layer bonded to the other surface is selected from the group consisting of a form of SiO2, silicon, ceramic, and plastic.
Specification