Process for forming a silicon-based film on a substrate using a temperature gradient across the substrate axis
First Claim
1. A process for forming a silicon-based film on a substrate, comprising providing a temperature gradient in the thickness direction of the substrate in the formation of the silicon-based film,wherein the temperature gradient is made such that a deposition surface of the substrate has a higher temperature than a backside, and wherein the silicon-based film is formed on the substrate loaded in a vacuum vessel, using a plasma CVD technique that involves introducing a source gas containing hydrogen and at least one of a hydrogenated silicon gas and a fluorinated silicon gas into the vacuum vessel and introducing high frequency waves into a high frequency input unit in the vacuum vessel.
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Abstract
In a process for forming a silicon-based film on a substrate according to the present invention, the substrate has a temperature gradient in the thickness direction thereof in the formation of the silicon-based film and the temperature gradient is made such that a deposition surface of the substrate has a higher temperature than a backside or the direction of the temperature gradient is reversed. With this configuration, the present invention provides a silicon-based thin film having good properties at a high deposition rate and provides a semiconductor device including it. The present invention also provides a semiconductor device including the silicon-based thin films that has good adhesion and weather-resisting properties and that can be manufactured in a short tact time.
52 Citations
37 Claims
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1. A process for forming a silicon-based film on a substrate, comprising providing a temperature gradient in the thickness direction of the substrate in the formation of the silicon-based film,
wherein the temperature gradient is made such that a deposition surface of the substrate has a higher temperature than a backside, and wherein the silicon-based film is formed on the substrate loaded in a vacuum vessel, using a plasma CVD technique that involves introducing a source gas containing hydrogen and at least one of a hydrogenated silicon gas and a fluorinated silicon gas into the vacuum vessel and introducing high frequency waves into a high frequency input unit in the vacuum vessel.
- 18. A process for forming a silicon-based film on a substrate, comprising providing a temperature gradient in the thickness direction of the substrate in the formation of the silicon-based film wherein the direction of the temperature gradient is reversed during the formation of the silicon-based film.
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37. A process for forming a silicon-based film on a substrate, comprising providing a temperature gradient in the thickness direction of the substrate in the formation of the silicon-based film,
wherein the temperature gradient is made such that a deposition surface of the substrate has a higher temperature than a backside, and wherein the temperature of the backside of the substrate is reduced in the course of forming the silicon-based film.
Specification