Integratable-fluid flow and property microsensor assembly

• US 6,794,981 B2
• Filed: 05/16/2002
• Issued: 09/21/2004
• Est. Priority Date: 12/07/1998
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Padmanabhan, Aravind, Cabuz, Cleopatra, Satren, Ernest, Schwichtenberg, Jay G.
• Primary Examiner(s): Easthom, Karl D.
• Application Number:
  US10/150,851
• Publication Number:
  US 20020190839A1
• Time in Patent Office: 859 Days
• Field of Search: 338/25, 338/13, 732/042.5
• US Class Current: 338/25
• CPC Class Codes: G01F 1/6842 with means for influencing the fluid flow
• CPC Class Codes: G01F 1/6845 Micromachined devices
• CPC Class Codes: G01F 5/00 Measuring a proportion of the volume flow
• CPC Class Codes: G01N 1/2247 Sampling from a flowing stream of gas
• CPC Class Codes: G01N 2001/2285 Details of probe structures
• CPC Class Codes: G01N 25/18 by investigating thermal conductivity by calorimetry G01N25/20; by measuring change of resistance of an electrically-heated body G01N27/18
• CPC Class Codes: G01N 25/488 Details
• CPC Class Codes: G01N 33/0014 by eliminating a gas G01N33/0013 and G01N33/0024 take precedence

Abstract

An integratable fluid flow and property microsensor assembly is configured to be operably embedded in a microfluidic cartridge of the type used in lab-on-a-chip systems. The assembly is a robust package having a microstructure flow sensor contained within a housing in order to achieve a robust sensing device. The cartridge provides a flow path to the assembly, which directs the fluid across the flow sensor and returns the fluid to the cartridge flow path. The flow sensor monitors the controlled flow of fluid and transmits signals indicative of that flow. The assembly structure provides a robust sensor that is operable and accurate in many different applications.

Claims

1. A sensor assembly for monitoring the flow of a fluid which is easily incorporated into a card assembly, the sensor assembly comprising:

a sensor die having a sensing surface which is responsive to the flow of fluid, the sensor die producing a signal indicative of the flow of fluid, the sensor die further having a plurality of electrical contacts for transmitting the electrical signals produced;

a sensor housing containing the sensor die while also providing access to the electrical contacts, the sensor housing having a fluid inlet, a fluid outlet, and a flow channel between the fluid inlet and the fluid outlet, the flow channel configured to direct fluid past the sensing surface, wherein the housing includes a substantially planar channeled portion and a substantially planar cover portion, wherein the flow channel is formed by a groove in the channeled portion which is enclosed by the attachment of the cover portion, and wherein the cover portion includes an opening to receive the sensor die; and

a plurality of connectors electrically connected to the electrical contacts for allowing access to the electrical signals by a related system.

2. The sensor assembly of claim 1 wherein the housing is made from a plastic substance.

3. The sensor assembly of claim 1 wherein the housing is made from a glass substance.

4. The sensor assembly of claim 1 wherein the sensor die is attached to both the channeled portion and the cover portion such that the sensing surface further enclosed a portion of the flow channel.

5. The sensor assembly of claim 1 wherein the housing is made from a ceramic substance.

6. The sensor assembly of claim 1 wherein the sensor die produces a signal indicative of a thermal conductivity of the fluid.

7. The sensor assembly of claim 1 wherein the sensor die produces a signal indicative of a specific heat of the fluid.

8. The sensor assembly of claim 1 wherein the plurality of connectors comprises flex circuits.

9. The sensor assembly of claim 1 wherein the plurality of connectors comprises ceramic circuit boards.

10. The sensor assembly of claim 1 wherein the plurality of connectors comprises a plurality of circuit traces on the card assembly for transmitting the electrical signals to an edge of the card assembly.

11. The sensor assembly of claim 10 where the electrical signals are propagated from the edge of the card assembly to the related system via a pogo pin array.

12. The sensor assembly of claim 10 where the electrical signals are propagated from the edge of the card assembly to the related system via a card edge connector.