×

Method and apparatus for supplying data and power to panel-supported components

  • US 6,795,320 B2
  • Filed: 11/22/2002
  • Issued: 09/21/2004
  • Est. Priority Date: 09/28/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. An electrically wired device enclosure comprising:

  • a first and second enclosed cable routing paths extending along at least one enclosed device mounting area;

    first and second cable segments having an insulation layer and a plurality of conductors disposed therein, the first and second cable segments being disposed within the first and second cable routing paths, and coupled to one another such that conductors of the first cable segment are electrically coupled to corresponding conductors of the second cable segment; and

    a device connector assembly including at least one device connector having insulation piercing elements for contacting the conductors of at least one of the cable segments through the insulation layer thereof, the device connector being configured to mate with a device cable from a device disposed and enclosed in the device enclosure.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×