Use of printing and other technology for micro-component placement
First Claim
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1. A method for adhering micro-components to a partially conductive substrate having conductive areas printed thereon, comprising:
- passing the partially conductive substrate within printing view of a first insertion tool containing an adherent;
depositing a portion of the adherent onto the conductive areas of the partially conductive substrate;
passing the partially conductive substrate having the portion of adherent thereon within printing view of a second insertion tool containing at least one micro-component; and
depositing the at least one micro-component onto the portion of adherent located on the conductive area of the partially conductive substrate.
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Abstract
An improved light-emitting panel having a plurality of micro-components sandwiched between two substrates is disclosed. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes. An improved method of manufacturing a light-emitting panel is also disclosed, which uses a web fabrication process to manufacturing light-emitting displays as part of a high-speed, continuous inline process.
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Citations
13 Claims
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1. A method for adhering micro-components to a partially conductive substrate having conductive areas printed thereon, comprising:
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passing the partially conductive substrate within printing view of a first insertion tool containing an adherent;
depositing a portion of the adherent onto the conductive areas of the partially conductive substrate;
passing the partially conductive substrate having the portion of adherent thereon within printing view of a second insertion tool containing at least one micro-component; and
depositing the at least one micro-component onto the portion of adherent located on the conductive area of the partially conductive substrate. - View Dependent Claims (2, 3, 4)
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5. A method for depositing a plurality of micro-components onto predetermined portions of a substrate comprising:
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charging the predetermined portions of the substrate with a first charge;
charging the plurality of micro-components with a second charge, wherein the first charge and the second charge are opposite charges; and
introducing the plurality of charged micro-components to the charged substrate wherein the charged micro-components are electrostatically attracted to the charged predetermined portions of the substrate.
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6. A method for depositing a plurality of micro-components onto predetermined portions of a substrate comprising:
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charging a first predetermined portion of the substrate with a first charge;
charging a first set of the plurality of micro-components with a second charge, wherein the first charge and the second charge are opposite charges;
introducing the first set of charged micro-components to the first charged portion of the substrate wherein the first set of charged micro-components is electrostatically attracted to the first charged portion of the substrate;
facilitating removal of micro-components from the first set of charged micro-components that did not adhere to the first charged portion of the substrate by means of a force applied to the substrate;
charging a second predetermined portion of the substrate with the first charge;
charging a second set of the plurality of micro-components with the second charge, wherein the first charge and the second charge are opposite charges;
introducing the second set of charged micro-components to the second charged portion of the substrate wherein the second set of charged micro-components is electrostatically attracted to the second charged portion of the substrate;
applying force to the substrate in order to remove micro-components from the second set of charged micro-components that did not adhere to the second charged portion of the substrate;
charging a third predetermined portion of the substrate with the first charge;
charging a third set of the plurality of micro-components with the second charge, wherein the first charge and the second charge are opposite charges;
introducing the third set of charged micro-components to the third charged portion of the substrate wherein the third set of charged micro-components is electrostatically attracted to the third charged portion of the substrate; and
applying force to the substrate in order to remove micro-components front the third set of charged micro-components that did not adhere to the third charged portion of the substrate. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. A continuous process for fabricating a plurality of light-emitting panels comprising:
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providing a first continuous line of substrate having a plurality of parallel conductors thereon;
passing the substrate within printing view of a first insertion tool containing an adherent;
depositing portions of the adherent onto area of the parallel conductors;
passing the substrate having the portions of adherent thereon within printing view of second insertion tool containing multiple micro-components; and
depositing the multiple micro-components onto the portions of adherent located on the parallel conductors;
disposing a second substrate over the first substrate such that the plurality of micro-components are sandwiched between the first substrate and the second substrate; and
cutting the first substrate and the second substrate to form the plurality light-emitting panels.
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Specification