Light-emitting diode packaging structure having rectification circuit

• US 6,797,984 B1
• Filed: 09/10/2003
• Issued: 09/28/2004
• Est. Priority Date: 09/10/2003
• Status: Active Grant

• Current Assignee: Lustrous Technology Ltd.
• Original Assignee: Para Light Electronics Co., Ltd.
• Inventors: Lin, Ming-Yao, Lin, Ming-Te
• Primary Examiner(s): Smith, Matthew
• Assistant Examiner(s): Lee, Calvin
• Application Number:
  US10/658,330
• Time in Patent Office: 384 Days
• Field of Search: 257/79-84, 257/119-122, 257/502, 257/601, 257/683, 438/30, 438/78, 438/109
• US Class Current: 257/82
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05B 45/30 Driver circuits
• CPC Class Codes: H05B 45/40 Details of LED load circuits

Abstract

A light emitting diode (LED) packaging structure with built-in rectification circuit is disclosed. The LED packaging structure includes an LED and a rectification circuit is formed inside the LED. Thus, the LED packaging structure is capable to receive an alternate current from an electrical main by the rectification circuit which converts the alternate current into a direct current for the LED whereby the LED can be directly connected to the electrical main and powered thereby without use of additional and external rectification device.

Claims

1. A light emitting diode packaging structure comprising:

a light emitting diode comprising a frame and a packaging portion packaging a portion of the frame, the frame comprising a primary support and first and second subsidiary supports on opposite sides of the primary support, a light-emitting chip having positive and negative poles being formed on the primary support; and

a rectification circuit comprised of diodes of low power high voltage construction, the diodes being formed on the first and second subsidiary supports respectively and electrically connected to the positive and negative poles of the light-emitting chip by leads.

2. The light emitting diode packaging structure as claimed in claim 1, wherein the rectification circuit comprises a bridge circuit.

3. A light emitting diode packaging structure comprising:

a light emitting diode comprising a frame and a packaging portion packaging a portion of the frame, the frame comprising a primary support and first and second subsidiary supports on opposite sides of the primary support, a substrate having pre-defined positive and negative electrodes being formed on the primary support and a light-emitting chip having positive and negative poles being formed on the substrate with the positive and negative poles of the light-emitting chip corresponding to and connected to the positive and negative electrodes of the substrate; and

a rectification circuit comprised of diodes of low power high voltage construction,the diodes being formed on the substrate and electrically connected to the first and second subsidiary supports respectively by leads.

4. The light emitting diode packaging structure as claimed in claim 3, wherein the rectification circuit comprises a bridge circuit.