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Semiconductor device having radiation structure

  • US 6,798,062 B2
  • Filed: 11/04/2003
  • Issued: 09/28/2004
  • Est. Priority Date: 11/24/1999
  • Status: Expired due to Term
First Claim
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1. A semiconductor device comprising:

  • a semiconductor chip;

    first and second radiation members thermally and electrically connected to the semiconductor chip interposed therebetween, and having a radiation surface for radiating heat from the semiconductor chip; and

    bump shaped banding members formed on a surface of one of the first and second radiation members; and

    a Resist Assist Bonding resin disposed in spaces between the bump shaped bonding members.

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