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Single package multi-chip RF power amplifier

  • US 6,798,295 B2
  • Filed: 12/13/2002
  • Issued: 09/28/2004
  • Est. Priority Date: 12/13/2002
  • Status: Expired due to Term
First Claim
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1. A multi-chip power amplifier comprising:

  • a) a housing having a plurality of input leads and a plurality of output leads, b) a plurality of semiconductor chips mounted in the housing, each chip comprising a transistor amplifier, c) a plurality of first matching networks with each matching network being in the housing and coupling a semiconductor chip to an input lead, and d) a plurality of second matching networks with each network being in the housing and coupling a semiconductor chip to an output lead whereby each chip has its own input lead and output lead.

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