Micromirror systems with open support structures

• US 6,798,560 B2
• Filed: 10/11/2002
• Issued: 09/28/2004
• Est. Priority Date: 10/11/2002
• Status: Active Grant

• Current Assignee: SK Hynix Inc.
• Original Assignee: Exajoule, LLC
• Inventors: Aubuchon, Christopher M.
• Primary Examiner(s): THOMPSON, TIMOTHY J
• Application Number:
  US10/269,478
• Publication Number:
  US 20040070815A1
• Time in Patent Office: 718 Days
• Field of Search: 359/291, 359/290, 359/292, 359/295, 438/52, 385/15, 385/16, 385/18, 385/19
• US Class Current: 359/291
• CPC Class Codes: G02B 26/06 for controlling the phase of light G02B26/08 takes precedence , measuring optical phase difference G01J9/00
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

Micromirror devices, especially for use in digital projection are disclosed. Other applications are contemplated as well. The devices employ a superstructure that includes a mirror supported over a hinge set above a substructure. Various improvements to the superstructure over known micromirror devices are provided. The features described are applicable to improve manufacturability, enable further miniaturization of the elements and/or to increase relative light return. Devices can be produced utilizing the various optional features described herein, possibly offering cost savings, lower power consumption, and higher resolution.

Claims

1. A micromirror device comprising:

a substrate with electrical components including address circuitry, and

an array of micromechanical light modulator elements, each micromechanical light modulator element comprising a mirror portion above said substrate, a plurality of hinge portions below said mirror portion and a plurality of electrode portions,

wherein at least one of a selected mirror portion, hinge portion or electrode portion is held above said substrate by a an open support located at an outer edge of the selected portion.

2. The device of claim 1, wherein each mirror portion is held above said substrate by a pair of discrete supports.

3. The device of claim 2, wherein said supports comprises a plurality of vertical sections.

4. The device of claim 3, wherein said plurality of vertical sections meet at a common base affixed to one of said hinge portions.

5. The device of claim 1, wherein said hinge portions are held above said substrate by at least one support.

6. The device of claim 5, wherein said hinge portions are attached to a connector segment spanning adjacent supports.

7. The device of claim 1, wherein at least one of said electrode portions is held above said substrate by at least one support.

8. The device of claim 7, wherein only one support is provided for each electrode portion, thereby supporting each said portion in a cantilever fashion.

9. A method of manufacturing support structures in a micromirror device comprising, a substrate with electrical components including address circuitry, and

an array of micromechanical light modulator elements, each micromechanical light modulator element comprising a mirror portion above said substrate, a plurality of hinge portions below said mirror portion and a plurality of electrode portions, said method comprising:

producing a precursor structure comprising two columns and an upper surface,

removing portions of said columns and said upper surface, leaving only a spanning segment of said precursor upper surface located between said precursor columns, and open supports attached to said spanning segment.

10. The method of claim 9, wherein said spanning segment comprises an electrode portion.

11. The method of claim 9, wherein said spanning segment comprises a mirror portion.

12. The method of claim 9, wherein said spanning segment is attached to at least one hinge portion.

13. A method of manufacturing electrodes in a micromirror device, comprising, a substrate with electrical components including address circuitry, and an array of micromechanical light modulator elements, each micromechanical light modulator element comprising a mirror portion above said substrate, a plurality of hinge portions below said mirror and a plurality of electrode portions, said method comprising:

providing a sacrificial layer of mater and on a first surface of said substrate,

depositing electrode material over said first surface and a second surface of said sacrificial layer, and

removing said sacrificial layer, leaving at least one electrode with an upper portion supported by an open support portion above an electrode lower portion on said substrate.

14. The method of claim 13, wherein said support portion is substantially vertical.

15. The method of claim 13, wherein at least one electrode comprises two levels.

16. The method of claim 13, wherein said upper portion is angled with respect to said substrate first surface.