Method and apparatus for computing placement costs by calculating bend values of connection graphs that model interconnect line topologies

• US 6,802,049 B2
• Filed: 12/15/2000
• Issued: 10/05/2004
• Est. Priority Date: 12/06/2000
• Status: Expired due to Term

• Current Assignee: Cadence Design Systems Incorporated (Cadence Group)
• Original Assignee: Cadence Design Systems Incorporated (Cadence Group)
• Inventors: Teig, Steven, Ganley, Joseph L.
• Primary Examiner(s): Smith, Matthew
• Assistant Examiner(s): Dinh, Paul
• Application Number:
  US09/739,460
• Publication Number:
  US 20030192021A1
• Time in Patent Office: 1,390 Days
• Field of Search: 716/1-18
• US Class Current: 716/124
• CPC Class Codes: G06F 2111/06 Multi-objective optimisation, e.g. Pareto optimisation using simulated annealing [SA], ant colony algorithms or genetic algorithms [GA]
• CPC Class Codes: G06F 30/392 Floor-planning or layout, e.g. partitioning or placement
• CPC Class Codes: G06F 30/394 Routing G06F30/396 takes precedence
• CPC Class Codes: G11B 7/08582 Sled-type positioners

Abstract

One embodiment of the invention is a recursive partitioning method that places circuit elements in an IC layout. This method initially defines a number of partitioning lines that divide an IC region into several sub-regions (also called slots). For a net in the region, the method then identifies the set of sub-regions (i.e., the set of slots) that contain the circuit elements (e.g., the pins or circuit modules) of that net. The set of sub-regions for the net represents the net'"'"'s configuration with respect to the defined partitioning lines. Next, the placement method identifies attribute or attributes of a connection graph that models the net'"'"'s configuration with respect to the partitioning lines. The connection graph for each net provides a topology of interconnect lines that connect the slots that contain the net'"'"'s circuit elements. According to some embodiments of the invention, the connection graph for each net can have edges that are completely or partially diagonal.

Claims

1. For a placer that places circuit modules in integrated-circuit (“

IC”

) layouts, the placer using a set of partitioning lines, that define a plurality of slots, to partition an IC layout region into a plurality of sub-regions corresponding to said slots, a method of computing costs of placing circuit modules in an IC-layout region, the method comprising;

a) selecting a first group of said slots; and

b) calculating a number of bends in a set of one or more interconnect lines for connecting the first group of said slots.

2. The method of claim 1 wherein the bends are diagonal bends.

3. For an electronic-design-automation placer that uses a set of partitioning lines, that define a plurality of slots, to partition an integrated-circuit (“

IC”

) layout region into a plurality of sub-regions corresponding to said slots, a method of pre-computing placement costs, the method comprising;

a) for each combination of said slots, identifying a connection graph that represents a topology of interconnect lines necessary for connecting the combination of said slots;

b) calculating a number of bends in each identified connection graph; and

c) storing the number of bends for each combination of slots in a storage structure.

4. The method of claim 3, wherein the connection graphs are Steiner trees.

5. The method if claim 3, wherein the connection graphs are minimum spanning trees.

6. For an electronic design automation (“

EDA”

) application that performs placement operations, a method of computing costs for placing circuit elements within an integrated-circuit (“

IC”

) layout, the method comprising;

a) defining a partitioning grid having a plurality of slots, said partitioning grid for partitioning a region of an IC layout into a plurality of sub-regions corresponding to said slots;

b) for each combination of said slots, identifying at least one connection graph that models a topology of interconnect lines for connecting the combination of said slots;

c) computing a length and number of bends in each of said connection graphs;

d) wherein when more than one connection graphs are identified for a particular combination of said slots, selecting the graph with the shortest length that has less than a first predetermined number of bends.

7. The method of claim 6, wherein when more than one connection graphs are identified for a particular combination of said slots and none of the connection graphs for the particular combination have less than the first predetermined number of bends, the method comprising selecting the graph that has less than a second predetermined number of bends.

8. A method of placing a set of circuit modules in an integrated-circuit layout region, the method comprising:

a) partitioning the region into a plurality of sub-regions;

b) identifying a connection graph that connects the sub-regions that contain the set of circuit modules;

c) computing a placement cost based on a number of bends in the connection graph.

9. The method of claim 8 further comprising specifying a placement based on the computed placement cost.

10. The method of claim 9, wherein the connection graph has Manhattan and non-Manhattan edges and has at least one bend at an intersection of a Manhattan edge and a on-Manhattan edge.

11. The method of claim 10 further comprising:

a) identifying a length of the connection graph;

b) computing the placement cost also based on the length of the connection graph.

12. A computer readable medium storing a computer program for placing a set of circuit modules in an integrated-circuit layout region, the computer program comprising sets of instructions for:

a) partitioning the region into a plurality of sub-regions;

b) identifying a connection graph that connects the sub-regions that contain the set of circuit modules;

c) computing a placement cost based on a number of bends in the connection graph.

13. The computer readable medium of claim 12, wherein the computer program further comprises sets of instructions for specifying a placement based on the computed placement cost.

14. The computer readable medium of claim 12, wherein the connection graph has Manhattan and non-Manhattan edges and has at least one bend at an intersection of a Manhattan edge and a non-Manhattan edge.

15. The computer readable medium of claim 14, wherein the computer program further comprises sets of instructions for:

a) identifying a length of the connection graph;

b) computing the placement cost also based on the length of the connection graph.

16. A method of placing a net in an integrated-circuit layout region, the method comprising:

a) identifying a connection graph for the net;

b) computing a placement cost based on a number of bends in the connection graph.

17. The method of claim 16 further comprising specifying a placement based on the computed placement cost.

18. The method of claim 17, wherein the connection graph has Manhattan and non-Manhattan edges and has at least one bend at an intersection of a Manhattan edge and a on-Manhattan edge.