Manufacturing process for laminated cards with intermediate PETG layer

• US 6,803,114 B1
• Filed: 05/13/2002
• Issued: 10/12/2004
• Est. Priority Date: 07/01/1999
• Status: Expired due to Fees

• Current Assignee: Axalto SA (Thales SA)
• Original Assignee: Schlumberger Systemes
• Inventors: Vere, Denis, Daniel, Eric
• Primary Examiner(s): Chen, Vivian
• Application Number:
  US10/030,205
• Time in Patent Office: 883 Days
• Field of Search: 428/480, 428/213, 428/212, 156/308.2, 156/309.6, 361/728, 361/736, 361/746, 361/737, 361/739, 361/761, 361/764, 235/488, 257/678, 257/679
• US Class Current: 428/480
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 428/24942 including components having same physical characteristic in differing degree
• CPC Class Codes: Y10T 428/2495 Thickness [relative or absolute]
• CPC Class Codes: Y10T 428/31786 Of polyester [e.g., alkyd, etc.]

Abstract

The invention involves a card, including a card body including at least three laminated plastic layers directly superimposed on each other, a second layer being a layer in polyethylene terephthalate glycol placed between a first layer and a third layer, the first layer and third layer being of a chemical nature different from that of said second layer, and an electronic module being incorporated in a cavity of the card body, the module including an integrated circuit, where the thickness of the second layer is of the same order of magnitude as that of the first and third layers, and wherein the cavity extends into the second layer from the first layer.

Claims

1. A card comprising a card body including at least three laminated plastic layers directly superimposed on each other, a second layer being a layer of polyethylene terephthalate glycol placed between a first layer and a third layer, said first layer and third layer being of a chemical nature different from that of said second layer, an electronic module being incorporated in a cavity of said card body, said module comprising an integrated circuit, wherein the thickness of said second layer is of the same order of magnitude as that of said first and third layers, and wherein the cavity extends into the second layer from the first layer, and wherein the electronic module is secured within the cavity by liquefied polyethylene terephthalate glycol from the second layer.

2. A manufacturing process for a card comprising a card body including at least three laminated plastic layers directly superimposed on each other, a second layer being a layer of polyethylene terephthalate glycol placed between a first layer and a third layer, said first layer and third layer being of a nature different from that of said second layer, an electronic module being incorporated in said card body, said module comprising an integrated circuit, comprises the steps of:

laminating said first layer, second layer, and third layer together so as to obtain a first laminated assembly, said second layer having a thickness of the same order of magnitude as that of said first and third layers;

creating a cavity extending into the second layer from the first layer;

inserting said module in said cavity; and

liquefying at least a portion of the second layer such that liquefied polyethylene terephthalate glycol flows into said cavity to secure said module.

3. A manufacturing process for a card comprising a card body including at least three laminated plastic layers directly superimposed on each other, a second layer being a layer of polyethylene terephthalate glycol placed between a first layer and a third layer, said first layer and third layer being of a nature different from that of said second layer, an electronic module being incorporated in said card body, said module comprising an integrated circuit, comprises the steps of:

laminating said first layer, second layer, and third layer together so as to obtain a first laminated assembly, said second layer having a thickness of the same order of magnitude as that of said first and third layers;

creating a cavity extending into the second layer from the first layer; and

inserting said module in said cavity,

wherein during a second lamination step the system comprising said first laminated assembly and said module is laminated so as to obtain a second laminated assembly, said second lamination step being executed under pressure and temperature conditions such that the polyethylene terephthalate glycol reaches its Vicat point and flows into the cavity.

4. The process according to claim 3, wherein said first laminated assembly is laminated directly superimposed on a fourth layer.