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Interconnect assembly for use in evaluating probing networks

  • US 6,803,779 B2
  • Filed: 06/11/2003
  • Issued: 10/12/2004
  • Est. Priority Date: 04/14/1995
  • Status: Expired due to Fees
First Claim
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1. An interconnect assembly for use in evaluating a probing device, a said probing device having a plurality of device probing ends, the device-probing ends each having a width and being separated from each other by a predetermined spacing, said interconnect assembly comprising:

  • (a) a base having a planar upper face, said face including a planar conductive pad, and said pad having a greatest dimension substantially equal to the width of each of said probing ends;

    (b) said face further including an annular dielectric area surrounding said conductive pad and coplanar therewith;

    (c) said face further including an outer conductive area surrounding said annular dielectric area and substantially coplanar therewith; and

    (d) said annular dielectric area having a radial width, between said conductive pad and said outer conductive area, substantially equal to said spacing between said device probing ends.

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