Signal readout circuit of an amplification type solid-state imaging device

• US 6,803,952 B1
• Filed: 01/31/2000
• Issued: 10/12/2004
• Est. Priority Date: 03/31/1999
• Status: Expired due to Fees

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Watanabe, Takashi
• Primary Examiner(s): Garber, Wendy R.
• Assistant Examiner(s): VILLECCO, JOHN M
• Application Number:
  US09/495,163
• Time in Patent Office: 1,716 Days
• Field of Search: 348/303, 348/304, 348/307, 348/241, 348/243, 348/245, 348/250, 348/294, 348/301, 348/300, 348/332, 250/208.1
• US Class Current: 348/241
• CPC Class Codes: H04N 25/616 involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
• CPC Class Codes: H04N 25/67 applied to fixed-pattern noise, e.g. non-uniformity of response

Abstract

An amplification type solid-state imaging device includes a pixel region including a plurality of amplification type photo-electric conversion elements arranged in a matrix array, vertical signal lines for transmitting a pixel signal and a reference signal for each pixel, a plurality of horizontal signal lines, a horizontal scanning circuit for transmitting signal pairs each including the pixel signal and the reference signal to the plurality of horizontal signal lines, a selection switch for sequentially switching the plurality of horizontal signal lines and for leading the plurality of horizontal signal lines into a common signal line, and a differential signal detection circuit in the common signal line for providing a differential signal between the pixel signal and the reference signal.

Claims

1. An amplification type solid-state imaging device comprising:

a pixel region including a plurality of amplification type photo-electric conversion elements arranged in a matrix array and each defining a pixel;

vertical signal lines provided in a one-to-one correspondence with columns of the array in the pixel region for transmitting a pixel signal and a reference signal for each pixel;

a plurality of horizontal signal lines;

a horizontal scanning circuit for sequentially transmitting signal pairs each including the pixel signal and the reference signal from the respective vertical signal lines to the plurality of horizontal signal lines;

a selection switch for sequentially switching the plurality of horizontal signal lines to selectively apply the signal pairs each including the pixel signal and the reference signal from the plurality of horizontal signal lines into a single common signal line; and

a differential signal detection circuit for providing a differential signal between the pixel signal and the reference signal in each of the signal pairs transmitted through the common signal line

wherein the pixel signal is a differential signal between the bright signal and the reset signal from each of the amplification type photo-electric conversion elements, and the reference signal is a constant potential signal.

2. The amplification type solid-state imaging device according to claim 1, wherein the plurality of horizontal signal lines comprises n horizontal signal lines (n:

an intefer not smaller than

     2) and

each n consecutive vertical signal lines are grouped and respectively connected to the n horizontal signal lines in a one-to-one correspondence.

3. The amplification type solid-state imaging device according to claim 2, wherein n is 2.

4. The amplification type solid-state imaging device according to claim 2, wherein n is 3.

5. The amplification type solid-state imaging device according to claim 1, wherein read-out switches are provided between the vertical signal lines and the horizontal signal lines, and

the read-out switches are sequentially opened and closed by the horizontal scanning circuit to read out the pixel signal and the reference signal in pair from each of the vertical signal lines and transit them to the plurality horizontal signal lines.

6. The amplification type solid-state imaging device according to claim 1, wherein an amplifier is provided on each of the vertical signal lines.

7. The amplification type solid-sate imaging device according to claim 1, wherein a sample/hold circuit and a buffer amplifier are provided between the selection switch and each of the horizontal signal lines.

8. The amplification type solid-state imaging device according to claim 1, wherein the pixel signal is a bright signal from each of the amplification type photo-electric conversion elements when light is applied, and the reference signal is a reset signal from each of the amplification type photo-electric conversion elements when reset is applied.

9. The amplification type solid-state imaging device according to claim 1, wherein a clamp circuit and a sample/hold circuit are provided on the common signal line, so that the differential signal between the pixel signal and the reference signal is provided by clamping one of the pixel signal and the reference signal transmitted in pair through the common signal line by the clamp circuit and sampling and holding the other signal by the sample/hold circuit.

10. The amplification type solid-state imaging device according to claim 9, wherein the clamp circuit comprises capacitors respectively connected to the horizontal signal lines in series, an inverting amplifier provided on the common signal line, and a short switch provided between an input and an output of the inverting amplifier.

11. An image reader in which the amplification type solid-state imaging device according to any one of claims 1 to 10 is incorporated as a two-dimensional CMOS image sensor.

12. An amplification type solid-state imaging device comprising:

a pixel region including a plurality of amplification type photo-electric conversion elements arranged in a matrix array and each defining a pixel;

vertical signal lines provided in a one-to-one correspondence with columns of the array in the pixel region for transmitting a pixel signal and a reference signal for each pixel;

a plurality of horizontal signal lines;

a horizontal scanning circuit for sequentially transmitting signal pairs each including the pixel signal and the reference signal from the respective vertical signal lines to the plurality of horizontal signal lines;

a selection switch for sequentially switching the plurality of horizontal signal lines to selectively apply the signal pairs each including the pixel signal and the reference signal from the plurality of horizontal signal lines into a single common signal line;

a differential signal detection circuit for providing a differential signal between the pixel signal and the reference signal in each of the signal pairs transmitted through the common signal line;

a sample/hold circuit between the selection switch and each of the horizontal signal lines; and

a buffer amplifier between the selection switch and each horizontal signal line.

13. An amplification type solid-state imaging device comprising:

a pixel region including a plurality of amplification type photo-electric conversion elements arranged in a matrix array and each defining a pixel;

vertical signal lines provided in a one-to-one correspondence with columns of the array in the pixel region for transmitting a pixel signal and a reference signal for each pixel;

a plurality of horizontal signal lines;

a horizontal scanning circuit for sequentially transmitting signal pairs each including the pixel signal and the reference signal from the respective vertical signal lines to the plurality of horizontal signal lines;

a selection switch for sequentially switching the plurality of horizontal signal lines to selectively apply the signal pairs each including the pixel signal and the reference signal from the plurality of horizontal signal lines into a single common signal line; and

a differential signal detection circuit for providing a differential signal between the pixel signal and the reference signal in each of the signal pairs transmitted through the common signal line;

a clamp circuit on the common signal line; and

a sample/hold circuit on the common signal line, so that the differential signal between the pixel signal and the reference signal is provided by clamping one of the pixel signal and the reference signal transmitted in pair through the common signal line by the clamp circuit and sampling and holding the other signal by the sample/hold circuit.

14. The amplification type solid-state imaging device according to claim 13, wherein the clamp circuit includes capacitors respectively connected to the horizontal signal lines in series, an inverting amplifier provided on the common signal line, and a short switch provided between an input and an output of the inverting amplifier.