Process control based on tool health data

• US 6,804,619 B1
• Filed: 08/30/2002
• Issued: 10/12/2004
• Est. Priority Date: 08/30/2002
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Wang, Jin, Chong, Robert J., Green, Eric O.
• Primary Examiner(s): Bui, Bryan
• Application Number:
  US10/231,910
• Time in Patent Office: 774 Days
• Field of Search: 702/81, 702/82, 702/34-36, 702/179, 700/100, 700/177, 700/44, 700/95, 700/108, 700/121, 700/174, 438/10, 438/17, 438/518, 438/522
• US Class Current: 702/84
• CPC Class Codes: G05B 19/4065 Monitoring tool breakage, life or condition
• CPC Class Codes: G05B 2219/37258 Calculate wear from workpiece and tool material, machining operations

Abstract

A method is provided for a process control based on tool health data. The method comprises processing a workpiece using a processing tool, receiving trace data associated with the processing of the workpiece from the processing tool and determining at least one value associated with a health of a portion of the processing tool based on at least a portion of the received trace data. The method further comprises adjusting processing of another workpiece based on the determined health value.

Claims

1. A method, comprising:

processing a workpiece using a processing tool;

receiving trace data associated with the processing of the workpiece from the processing tool;

determining at least one value associated with a health of a portion of the processing tool based on at least a portion of the received trace data; and

adjusting processing of another workpiece based on the determined health value.

2. The method of claim 1, wherein processing the workpiece comprises processing a semiconductor wafer.

3. The method of claim 2, wherein adjusting the processing of another semiconductor wafer comprises adjusting one or more recipe parameters based on the determined health value.

4. The method of claim 2, further comprising determining a value associated with the overall health of the processing tool.

5. The method of claim 4, further comprising determining if the value associated with the overall health of the processing tool is greater than a pre-selected threshold value.

6. The method of claim 5, wherein adjusting the processing of another semiconductor wafer comprises adjusting the processing based on determining that the overall health of the processing tool is greater than the pre-selected threshold value.

7. The method of claim 4, wherein determining the at least one value associated with the health of the processing tool comprises determining an operational condition associated with one or more components of the processing tool.

8. An apparatus, comprising:

an interface adapted to receive trace data associated with processing a semiconductor wafer of a lot; and

a controller communicatively coupled to the interface, the controller adapted to;

determine health data associated with one or more components of the processing tool based on at least a portion of the received trace data; and

adjust processing of another semiconductor wafer in the lot based on the determined health data.

9. The apparatus of claim 8, wherein the controller is adapted to adjust one or more recipe parameters based on the determined health data.

10. The apparatus of claim 9, wherein the controller is adapted to determine a value associated with the overall health of the processing tool.

11. The apparatus of claim 10, wherein the controller is adapted to determining if the value associated with the overall heath of the processing tool is greater than a pre-selected threshold value.

12. The apparatus of claim 11, wherein the controller is adapted to adjust the processing based on determining that the overall health of the processing tool is greater than the pre-selected threshold value.

13. The apparatus of claim 8, wherein the controller is adapted to determine the health data associated with the health of a plurality of components of a deposition tool.

14. The apparatus of claim 8, wherein the health data comprises at least one of a temperature, power, and pressure level within a chamber of the processing tool.

15. An apparatus, comprising:

means for processing a workpiece using a processing tool;

means for receiving trace data associated with the processing of the workpiece from the processing tool;

means for determining at least one value associated with a health of a portion of the processing tool based on at least a portion of the received trace data; and

means for adjusting processing of another workpiece based on the determined health value.

16. An article comprising one or more machine-readable storage media containing instructions that when executed enable a processor to:

receive trace data associated with processing of a wafer by a processing tool;

generate one or more health statistics associated with the operation of the processing tool based on at least a portion of the received trace data; and

provide at least one of the health statistic to a controller to adjust one or more parameters of the recipe based on the at least one health statistic.

17. The article of claim 16, wherein the instructions when executed enable the processor to determine a value associated with the overall health of the processing tool.

18. The article of claim 17, wherein the instructions when executed enable the processor to determine if the value associated with the overall health of the processing tool is greater than a pre-selected threshold value.

19. The article of claim 18, wherein the instructions when executed enable the processor to adjust the processing based on determining that the overall health of the processing tool is greater than the pre-selected threshold value.

20. The article of claim 19, wherein the instructions when executed enable the processor to provide a plurality of the health statistics to the controller to adjust one or more parameters of the recipe based on the health statistics.

21. An apparatus, comprising:

an interface; and

a controller communicatively coupled to the interface, the controller adapted to;

receive one or more health statistics associated with a processing tool that is under direction of the controller;

calculate at least one parameter of a recipe based on the one or more health statistics; and

cause processing of a wafer based on the at least one calculated recipe parameter.

22. The apparatus of claim 21, wherein the controller is adapted to receive an overall health value associated with the processing tool and cause the processing to be stopped if the overall health value is less than a pre-selected threshold value.

23. A system, comprising:

a processing tool adapted to provide trace data associated with a processing of a wafer of a lot;

a fault detection and classification system adapted to;

determine one or more health statistics associated with a health of a processing tool based on at least a portion of the trace data; and

provide the one or more health statistics to a controller; and

a controller for controlling the processing of the processing tool, the controller adapted to adjust the processing of a next wafer of the lot based on at least one of the health statistics.

24. The system of claim 23, wherein an advanced process control is coupled between the processing tools and the fault detection and classification system.