Method of marking a substrate using an electret stencil
First Claim
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1. A method of marking a substrate comprising:
- providing an electret stencil comprising an electret film having a first major surface, a second major surface opposed to the first major surface, and at least one perforation extending through the film and connecting the first and second major surfaces;
providing a substrate having a surface;
electrostatically and removably adhering the stencil to the surface of the substrate;
applying a medium to the surface of the substrate through the at least one perforation of the stencil; and
removing the stencil from the surface of the substrate.
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Abstract
A stencil comprises an electret film, wherein the film has at least one perforation having a perimeter that defines an area, and wherein the area is greater than or equal to about one square centimeter. Methods of marking a substrate using stencils of the present invention are also disclosed.
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Citations
14 Claims
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1. A method of marking a substrate comprising:
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providing an electret stencil comprising an electret film having a first major surface, a second major surface opposed to the first major surface, and at least one perforation extending through the film and connecting the first and second major surfaces;
providing a substrate having a surface;
electrostatically and removably adhering the stencil to the surface of the substrate;
applying a medium to the surface of the substrate through the at least one perforation of the stencil; and
removing the stencil from the surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification