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Method of marking a substrate using an electret stencil

  • US 6,805,048 B2
  • Filed: 08/30/2002
  • Issued: 10/19/2004
  • Est. Priority Date: 08/30/2002
  • Status: Active Grant
First Claim
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1. A method of marking a substrate comprising:

  • providing an electret stencil comprising an electret film having a first major surface, a second major surface opposed to the first major surface, and at least one perforation extending through the film and connecting the first and second major surfaces;

    providing a substrate having a surface;

    electrostatically and removably adhering the stencil to the surface of the substrate;

    applying a medium to the surface of the substrate through the at least one perforation of the stencil; and

    removing the stencil from the surface of the substrate.

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