×

Method and apparatus for the abatement of toxic gas components from a semiconductor manufacturing process effluent stream

  • US 6,805,728 B2
  • Filed: 12/09/2002
  • Issued: 10/19/2004
  • Est. Priority Date: 12/09/2002
  • Status: Expired due to Fees
First Claim
Patent Images

1. A process for reducing a concentration of at least one toxic gas component from a semiconductor process effluent stream containing same, said method comprising:

  • contacting said semiconductor process effluent with a first sorbent layer composition so as to retain at least a portion of the toxic gas component therein; and

    contacting said process effluent with a second layer sorbent composition, so as to retain a second portion of the toxic gas component therein, wherein said first sorbent layer comprises a material having a high sorptive capacity for said toxic component and said second sorbent layer material comprises a material having a high capture rate sorptive affinity for the toxic component.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×