Method for producing solid-state image pickup device

• US 6,805,767 B2
• Filed: 03/19/2002
• Issued: 10/19/2004
• Est. Priority Date: 10/09/2001
• Status: Expired due to Fees

• Current Assignee: Renesas Technology Corporation (Renesas Electronics Corporation)
• Original Assignee: Renesas Technology Corporation (Renesas Electronics Corporation)
• Inventors: Shinomiya, Kohji
• Primary Examiner(s): Aftergut, Jeff H.
• Assistant Examiner(s): WARD, JESSICA LEE
• Application Number:
  US10/100,147
• Publication Number:
  US 20030066591A1
• Time in Patent Office: 945 Days
• Field of Search: 156/204, 156/221, 156/226-228, 156/288, 156/580, 361/749, 361/752, 257/432-434, 257/690, 257/693, 257/678, 257/98-99, 257/680, 257/684, 348/340, 348/374
• US Class Current: 156/227
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/02 Details
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: Y10T 156/1015 Folding
• CPC Class Codes: Y10T 156/1049 Folding only
• CPC Class Codes: Y10T 156/1051 by folding

Abstract

A method of producing a solid image pickup device including a solid image pickup element, and an optical lens held in a housing that is mounted on a flexible wiring board. A fixing device fixes the flexible wiring board in a folded state corresponding to an external shape of the solid image pickup device during bonding of the flexible wiring board.

Claims

1. A method of producing a solid image pickup device having a solid-state image pickup element, an optical lens, a housing containing the optical lens, and a flexible wiring board on which the housing is mounted, the method comprising

folding the flexible wiring board;

inserting the flexible wiring board, after folding, into a recess within a fixing device, surrounding and holding the flexible wiring board in a shape corresponding to an external shape of said solid-state image pickup device; and

bonding the flexible wiring board in the shape corresponding to the external shape of said solid-state image pickup device.

2. The method according to claim 1, comprising mounting the solid-state image pickup element on a first surface of the flexible wiring board and mounting the housing containing the optical lens on a second surface of the flexible wiring board.

3. The method according to claim 1, wherein the flexible wiring board includes an integral lead line with an electrode for external connection of the lead line.

4. The method according to claim 1, comprising flip chip bonding the solid-state image pickup element to the flexible wiring board.

5. The method according to claim 1, including mounting an optical filter in the housing.

6. The method according to claim 1, wherein said fixing device comprises at least a holding section including the recess and receiving said solid-state image pickup device, and including inserting a pressing section into the recess of said holding section to press the housing and flexible wiring board during bonding of the flexible wiring board.

7. The method according to claim 6, wherein said pressing section of said fixing device includes a degassing hole.

8. The method according to claim 6, wherein said holding section of said fixing device includes a degassing hole.

9. A method of producing a solid-state image pickup device having a solid-state image pickup element, a housing, an optical lens held in the housing, a flexible wiring board, and an IC (integrated circuit) mounted on the flexible wiring board, the method comprising

folding the flexible wiring board;

inserting the flexible wiring board, after folding, into a recess within a fixing device, surrounding and holding the flexible wiring board in a shape corresponding to an external shape of said solid-state image pickup device; and

bonding the flexible wiring board in the shape corresponding to the external shape of said solid-state image pickup device.

10. The method according to claim 9, comprising flip chip bonding the solid image pickup element to the flexible wiring board.

11. The method according to claim 9, comprising bonding and fixing the solid-state image pickup element and the IC.

12. The method according to claim 9, wherein said fixing device comprises at least a holding section including the recess and receiving said solid-state image pickup device, and including inserting a pressing section into the recess of said holding section to press the housing and flexible wiring board during bonding of the flexible wiring board.

13. The method according to claim 12, wherein said pressing section of said fixing device includes a degassing hole.

14. The method according to claim 12, wherein said holding section of said fixing device includes a degassing hole.